Abstract
To meet the challenges of designing mechatronic products, a program called MIDCAD was implemented which combines the functionality of Electronic Computer Aided Design (ECAD) and Mechanic CAD (MCAD) systems. Especially three-dimensional Molded Interconnect Devices (MID) and the layout of the electrical circuitry on their spatial surfaces are supported. In addition to MIDCAD there is a new research project working out the integration of macro-MID technology in automobiles (IMTP). On the one hand, the MCAD system CATIA V5 was enhanced by a computation of electrical properties of electric circuits and an automatic generation of the 3D electric conductor layout. The second part accomplishes the preparation of product information in CAD for automated production processes (CAM). This CAD-CAM-chain for a new technology called Flamecon® was developed in cooperation with LEONI AG, Germany. Furthermore, a technology database for MIDs was integrated plus a universal data format for geometry and extended information was implemented.
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Fischer, C., Franke, J., Feldmann, K. (2010). Two Approaches for the Design of Molded Interconnect Devices (3D-MID). In: Huang, G.Q., Mak, K.L., Maropoulos, P.G. (eds) Proceedings of the 6th CIRP-Sponsored International Conference on Digital Enterprise Technology. Advances in Intelligent and Soft Computing, vol 66. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-10430-5_6
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DOI: https://doi.org/10.1007/978-3-642-10430-5_6
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