Abstract
3D NoC offers greater device integration, faster vertical interconnects and more power efficient inter-layer communication due to the beneficial attribute of short through silicon via (TSV) in 3D IC technologies. However, TSV pads used for bonding to a wafer layer, occupy significant chip area and result in routing congestions and expensive manufacturing process. This can lead to a significant reduction in 3D ICs’ yield and higher power densities compared to 2D NoCs. In this paper, a power-efficient and low-cost inter-layer communication scheme is proposed as one way to mitigate these challenges. Instead of using a pair of unidirectional channels for inter-layer communication, utilizing a high-performance bidirectional channel enables a system to benefit from low-latency nature of the vertical interconnects and to remarkably reduce the number of TSVs. Additionally, we present a forecasting-based dynamic frequency scaling technique for reducing the power consumption of the inter-layer communication. Our extensive simulations demonstrate significant area and power improvements compared to a typical symmetric 3D NoC.
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Rahmani, AM., Vaddina, K.R., Liljeberg, P., Plosila, J., Tenhunen, H. (2011). Power and Area Optimization of 3D Networks-on-Chip Using Smart and Efficient Vertical Channels. In: Ayala, J.L., GarcĂa-Cámara, B., Prieto, M., Ruggiero, M., Sicard, G. (eds) Integrated Circuit and System Design. Power and Timing Modeling, Optimization, and Simulation. PATMOS 2011. Lecture Notes in Computer Science, vol 6951. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-24154-3_28
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DOI: https://doi.org/10.1007/978-3-642-24154-3_28
Publisher Name: Springer, Berlin, Heidelberg
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