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Self-controlling Structures Using Thermal Shape Memory Alloys

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Frontiers in Computer Education

Part of the book series: Advances in Intelligent and Soft Computing ((AINSC,volume 133))

Abstract

Due to their high specific workloads and small spatial requirements, shape memory alloys (SMA) possess an outstanding potential to serve as miniaturized positioning devices in small machines. They provide sensory and actory capabilities, being self-sufficient and a structure inherent control loop. Based on its unique properties we present examples of SMA-actuated applications and methods of modeling systems, in which the material is used to compensate thermal induced strain in machine tool relevant applications and show how the overall system design can be achieved.

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Author information

Authors and Affiliations

  1. Fraunhofer Institute for Machine Tools and Forming Technology, Reichenhainer Str. 88, 09126, Chemnitz, Germany

    André Bucht, Kenny Pagel, Tom Junker & Welf-Guntram Drossel

  2. Institute for Machine Tools and Production Processes, Chemnitz University of Technology, Reichenhainer Str. 70, 09126, Chemnitz, Germany

    Iñaki Navarroy de Sosa

Authors
  1. André Bucht
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  2. Iñaki Navarroy de Sosa
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  3. Kenny Pagel
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  4. Tom Junker
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  5. Welf-Guntram Drossel
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Editor information

Editors and Affiliations

  1. South China Normal University, Guangzhou, 510631, China, People's Republic

    Sabo Sambath

  2. South China Normal University, Guangzhou, 510631, China, People's Republic

    Egui Zhu

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© 2012 Springer-Verlag GmbH Berlin Heidelberg

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Bucht, A., de Sosa, I.N., Pagel, K., Junker, T., Drossel, WG. (2012). Self-controlling Structures Using Thermal Shape Memory Alloys. In: Sambath, S., Zhu, E. (eds) Frontiers in Computer Education. Advances in Intelligent and Soft Computing, vol 133. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-27552-4_145

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  • DOI: https://doi.org/10.1007/978-3-642-27552-4_145

  • Publisher Name: Springer, Berlin, Heidelberg

  • Print ISBN: 978-3-642-27551-7

  • Online ISBN: 978-3-642-27552-4

  • eBook Packages: EngineeringEngineering (R0)

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