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A Scan Chain Based SEU Test Method for Microprocessors

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Computer Engineering and Technology (NCCET 2013)

Part of the book series: Communications in Computer and Information Science ((CCIS,volume 396))

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Abstract

A test method based on the scan chain technique is proposed to evaluate the single event upset performance for all the flip-flops in the microprocessors. The single event upset (SEU) performance of a digital signal processor is evaluated using the proposed method and program test method with different working frequencies. Heavy ion irradiation experiment results show that this method is able to capture all the SEUs in the whole chip with no escape and has few infections from the single event transients, which is helpful to study the SEUs precisely in the complicated processors.

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References

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Authors and Affiliations

  1. College of Computer, National University of Defense Technology, Deya Str. 109, Changsha, 410073, P.R. China

    Yaqing Chi, Yibai He, Bin Liang & Chunmei Hu

  2. National Key Laboratory of Science and Technology on Reliability Physics and Application Technology of Electrical Component, Dongguanzhuang Str. 110, Guanzhou, 510610, P.R. China

    Yaqing Chi

Authors
  1. Yaqing Chi
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  2. Yibai He
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  3. Bin Liang
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  4. Chunmei Hu
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Editor information

Editors and Affiliations

  1. National University of Defense Technology, Changsha, China

    Weixia Xu  & Liquan Xiao  & 

  2. School of Computer, National University of Defense Technology, 410073, Changsha, Hunan, P.R. China

    Chengyi Zhang

  3. National University of Defense Technology, Changsha, P.R. China

    Jinwen Li

  4. School of Computer Science, National University of Defense Technology, Changsha, Hunan, P.R. China

    Liyan Yu

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© 2013 Springer-Verlag Berlin Heidelberg

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Chi, Y., He, Y., Liang, B., Hu, C. (2013). A Scan Chain Based SEU Test Method for Microprocessors. In: Xu, W., Xiao, L., Zhang, C., Li, J., Yu, L. (eds) Computer Engineering and Technology. NCCET 2013. Communications in Computer and Information Science, vol 396. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-41635-4_19

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  • DOI: https://doi.org/10.1007/978-3-642-41635-4_19

  • Publisher Name: Springer, Berlin, Heidelberg

  • Print ISBN: 978-3-642-41634-7

  • Online ISBN: 978-3-642-41635-4

  • eBook Packages: Computer ScienceComputer Science (R0)

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