Skip to main content

Entwurf eines systolischen Arrays in Wafer Scale Technik für die digitale Signalverarbeitung

  • Conference paper
GI — 18. Jahrestagung II

Part of the book series: Informatik-Fachberichte ((INFORMATIK,volume 188))

  • 54 Accesses

Abstract

Die Wafer Scale Integration erlaubt die monolithische Integration kompletter Systeme. Es wird ein SIMD Prozessor-Array mit ca. 10000 Knoten beschrieben, das in Wafer Scale Technik gefertigt wird. Ein Knotenprozessor enthält sechs ein-Bit Register, eine ein-Bit ALU und 128 Bits RAM. Zur Erzielung von Defekttoleranz wird eine zweistufige Hierarchie mit unterschiedlichen Rekonfigurierungskonzepten verwendet. Anwendungen eines solchen SIMD-Arrays ergeben sich in der Echtzeitbildverarbeitung und bei assoziativen Prozessoren.

This is a preview of subscription content, log in via an institution to check access.

Access this chapter

Subscribe and save

Springer+ Basic
$34.99 /Month
  • Get 10 units per month
  • Download Article/Chapter or eBook
  • 1 Unit = 1 Article or 1 Chapter
  • Cancel anytime
Subscribe now

Buy Now

Chapter
USD 29.95
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever

Tax calculation will be finalised at checkout

Purchases are for personal use only

Institutional subscriptions

Preview

Unable to display preview. Download preview PDF.

Unable to display preview. Download preview PDF.

Similar content being viewed by others

Literatur

  1. K.E. Batcher Design of a Massively Parallel Processor IEEE Trans, on Comp., C 29, pp 863–840, 1980

    Article  Google Scholar 

  2. John J. Barrett, Elisabeth M. Smits, P.L. Moran A Copper Tracking Technique for Wafer Scale Integration IFIP Workshop on Wafer Scale Integration Grenoble, March 17–19 1986

    Google Scholar 

  3. G.H. Chapman Laser-Linking Technology for VLSI Workshop on Wafer Scale Integration Southampton, July 10–12 1985

    Google Scholar 

  4. G. Chevalier, G. Saucier A Programmable Switch Matrix for the Wafer Scale Integration of a Processor Array Workshop on Wafer Scale Integration Southampton, July 10–12 1985

    Google Scholar 

  5. P.E. Danielsson, T. Ericsson Suggestion for an Image Processor Array Internal Report LITH—ISY–0507 Linköping University, Sweden, 1982

    Google Scholar 

  6. T.J. Fountain Towards CLIP6 — An Extra Dimension IEEE Computer Workshop on Computer Architecture for Pattern Analysis and Image Database Management Hot Springs, Va, pp 25–30, 1981

    Google Scholar 

  7. T.J. Fountain A Survey of bit—serial array processor circuits in: Computer Structure for Image Processing (ed. M J B Duff) Academic Press, pp 1–14, 1983

    Google Scholar 

  8. P. Girard, F.M. Roche, B. Pistolet Electron Beam Effects on VLSI MOS conditions for Testing and Reconfiguration IFIP Workshop on Wafer Scale Integration Grenoble, March 17–19 1986

    Google Scholar 

  9. Manolis G.H. Katevenis, Miriam G. Blatt Switch Design for Soft—Configurable WSI Systems IFIP Workshop on Wafer Scale Integration Grenoble, March 17–19 1986

    Google Scholar 

  10. T. Leighton, C.E. Leiserson A Survey for Integrating Wafer Scale Systems IFIP Workshop on Wafer Scale Integration Grenoble, March 17–19 1986

    Google Scholar 

  11. Hubert H. Love Recoufigurable Parallel Array Systems pp. 99–244 in Designing and Programming Modern Computer Systems Vol.1 Editors: Svetlana and Steven I. Kartashev Prentice Hall 1982

    Google Scholar 

  12. Roberto Negrini, Renato Stefanelli Comparative Evaluation of Space—and Time—Redundancy Approaches IFIP Workshop on Wafer Scale Integration Grenoble, March 17–19 1986

    Google Scholar 

  13. G. Nicolas Technical and Economical Aspect of Laser Repair for WSI Memory IFIP Workshop on Wafer Scale Integration Grenoble, March 17–19 1986

    Google Scholar 

  14. J.I. Raffel The RVLSI Approach to Wafer Scale Integration Workshop on Wafer Scale Integration Southampton, July 10–12 1985

    Google Scholar 

  15. S.F. Reddaway DAP — A Distributed Processor Array First Annual Symposium on Computer Architecture pp 61–65 Florida, 1973

    Chapter  Google Scholar 

  16. F.M. Rhodes Applications of RVLSI to Signal Processing Workshop on Wafer Scale Integration Southampton, July 10–12 1985

    Google Scholar 

  17. I.N. Robinson, W.R. Moore A Parallel Processor Array Architecture and its implementation in silicon Proceedings of IEEE Custom Integrated Circuits Conference pp 41–45 Rochester, N.Y, 1982

    Google Scholar 

  18. T. Sudo, T. Nakashima An LSI Adaptive Array Processor IEEE Solid State Circuits Conference, pp 122–123 & 307, 1982

    Google Scholar 

  19. Mighsien Wang, Michael Cutler, Stephen Y.H. Su On-Line Error Detection and Reconfiguration of Array Processors with Two Level Redundancy Proceedings of the COMP EURO, Hamburg, May 11–15 1987

    Google Scholar 

Download references

Author information

Authors and Affiliations

Authors

Editor information

Editors and Affiliations

Rights and permissions

Reprints and permissions

Copyright information

© 1988 Springer-Verlag Berlin Heidelberg

About this paper

Cite this paper

Glesner, M., Huch, M., Ivey, P.A., Midwinter, T., Saucier, G., Trilhe, J. (1988). Entwurf eines systolischen Arrays in Wafer Scale Technik für die digitale Signalverarbeitung. In: Valk, R. (eds) GI — 18. Jahrestagung II. Informatik-Fachberichte, vol 188. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-74135-7_5

Download citation

  • DOI: https://doi.org/10.1007/978-3-642-74135-7_5

  • Publisher Name: Springer, Berlin, Heidelberg

  • Print ISBN: 978-3-540-50360-6

  • Online ISBN: 978-3-642-74135-7

  • eBook Packages: Springer Book Archive

Publish with us

Policies and ethics