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Connections of Multi Memristors

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Bio-Inspired Computing -- Theories and Applications (BIC-TA 2015)

Part of the book series: Communications in Computer and Information Science ((CCIS,volume 562))

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Abstract

After the successful solid state implementation of the memristor, the memristor based on circuit has gained an increasing attention as next generation electronic passive devices. In this work, multi memristors in series and parallel connection are considered as different subsystems. First, these subsystems are driven by a voltage source, respectively. The inter-dependence relation among voltage, current, charge, flux and the normalized width of the doped region are taken into consideration to a complete mathematical model for each memristor. Then, we use these connected subsystems of multi memristors to replace Chua’s diode. The combinations of memristors in circuits can give rise to rich enough dynamical behavior that it wouldn’t produce further complications of adding in other circuit elements. Multi memristors in series and parallel are given to illustrate an important step towards real world memristor system applications.

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Acknowledgments

The authors thank the editor and the anonymous reviewers for their resourceful and valuable comments and constructive suggestions. Project is supported by the State Key Program of the National Natural Science Foundation of China (Grant No. 61134012), the National Natural Science Foundation of China (Grant Nos. 11271146 and 61070238), and the Science and Technology Program of Wuhan (Grant No. 20130105010117), Innovation Scientists and Technicians Troop Construction Projects of Henan Province (154200510012).

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Correspondence to Guangzhao Cui .

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Sun, J., Wang, Y., Cui, G. (2015). Connections of Multi Memristors. In: Gong, M., Linqiang, P., Tao, S., Tang, K., Zhang, X. (eds) Bio-Inspired Computing -- Theories and Applications. BIC-TA 2015. Communications in Computer and Information Science, vol 562. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-662-49014-3_35

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  • DOI: https://doi.org/10.1007/978-3-662-49014-3_35

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  • Publisher Name: Springer, Berlin, Heidelberg

  • Print ISBN: 978-3-662-49013-6

  • Online ISBN: 978-3-662-49014-3

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