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DNA 3D Self-assembly Algorithmic Model to Solve Maximum Clique Problem

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Bio-inspired Computing: Theories and Applications (BIC-TA 2018)

Part of the book series: Communications in Computer and Information Science ((CCIS,volume 951))

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Abstract

Self-assembly reveals the essence of DNA computing, DNA self-assembly is thought to be the best way to make DNA computing transform into computer chip. This paper introduce a method of DNA 3D self-assembly algorithm to solve the Maximum Clique Problem. Firstly, we introduce a non-deterministic algorithm. Then, according to the algorithm we design the types of DNA tiles which the computation needs. Lastly, we demonstrate the self-assembly process and the experimental methods which could get the final result. The computation time is linear, and the number of the distinctive tile types is constant.

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Author information

Authors and Affiliations

  1. School of Statistics, Shanxi University of Finance and Economics, Taiyuan, Shanxi, China

    Jingjing Ma

  2. North Automatic Control Technology Institute, Taiyuan, Shanxi, China

    Wenbin Gao

Authors
  1. Jingjing Ma
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  2. Wenbin Gao
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Corresponding author

Correspondence to Jingjing Ma .

Editor information

Editors and Affiliations

  1. Beijing University of Posts and Telecommunications, Beijing, China

    Jianyong Qiao

  2. Beijing University of Posts and Telecommunications, Beijing, China

    Xinchao Zhao

  3. Huazhong University of Science and Technology, Wuhan, China

    Linqiang Pan

  4. Beijing University of Posts and Telecommunications, Beijing, China

    Xingquan Zuo

  5. Anhui University, Hefei, China

    Xingyi Zhang

  6. City University of Hong Kong, Kowloon, Hong Kong

    Qingfu Zhang

  7. Beijing University of Posts and Telecommunications, Beijing, China

    Shanguo Huang

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© 2018 Springer Nature Singapore Pte Ltd.

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Cite this paper

Ma, J., Gao, W. (2018). DNA 3D Self-assembly Algorithmic Model to Solve Maximum Clique Problem. In: Qiao, J., et al. Bio-inspired Computing: Theories and Applications. BIC-TA 2018. Communications in Computer and Information Science, vol 951. Springer, Singapore. https://doi.org/10.1007/978-981-13-2826-8_15

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  • DOI: https://doi.org/10.1007/978-981-13-2826-8_15

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  • Publisher Name: Springer, Singapore

  • Print ISBN: 978-981-13-2825-1

  • Online ISBN: 978-981-13-2826-8

  • eBook Packages: Computer ScienceComputer Science (R0)

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