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Tooling Cardboard for Smart Reuse: A Digital and Analog Workflow for Upcycling Waste Corrugated Cardboard as a Building Material

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Computer-Aided Architectural Design. "Hello, Culture" (CAAD Futures 2019)

Part of the book series: Communications in Computer and Information Science ((CCIS,volume 1028))

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Abstract

This paper is a description of a hybridized digital and analog workflow for reusing waste corrugated cardboard as a building material. The work explores a combination of digital design and analog fabrication tools to create a workflow that would help designers/builders to negotiate with the material variability of waste cardboard. The workflow discussed here was implemented for designing and fabricating a prototypical modular floor panel using different sheets of waste cardboard combined with repurposed wood. The implementation shows that combining digital and analog tools can create a novel approach to material reuse, and facilitate a design/fabrication culture of smart reuse that supports informal building and making at recycling collection centers in developing countries for housing alternatives.

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Author information

Authors and Affiliations

  1. Stuckeman School of Architecture and Landscape Architecture, The Pennsylvania State University, University Park, PA, 16802, USA

    Julio Diarte, Elena Vazquez & Marcus Shaffer

  2. Facultad de Arquitectura, Diseño y Artes, Universidad Nacional de Asuncion, Campus Universitario, San Lorenzo, Paraguay

    Julio Diarte

Authors
  1. Julio Diarte
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  2. Elena Vazquez
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  3. Marcus Shaffer
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Corresponding author

Correspondence to Julio Diarte .

Editor information

Editors and Affiliations

  1. Korea Advanced Institute of Science and Technology, Daejeon, Korea (Republic of)

    Ji-Hyun Lee

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Diarte, J., Vazquez, E., Shaffer, M. (2019). Tooling Cardboard for Smart Reuse: A Digital and Analog Workflow for Upcycling Waste Corrugated Cardboard as a Building Material. In: Lee, JH. (eds) Computer-Aided Architectural Design. "Hello, Culture". CAAD Futures 2019. Communications in Computer and Information Science, vol 1028. Springer, Singapore. https://doi.org/10.1007/978-981-13-8410-3_27

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  • DOI: https://doi.org/10.1007/978-981-13-8410-3_27

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  • Publisher Name: Springer, Singapore

  • Print ISBN: 978-981-13-8409-7

  • Online ISBN: 978-981-13-8410-3

  • eBook Packages: Computer ScienceComputer Science (R0)

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