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Spectral Efficiency for Multi-pair Massive MIMO Two-Way Relay Networks with Hybrid Processing

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Communications, Signal Processing, and Systems (CSPS 2019)

Part of the book series: Lecture Notes in Electrical Engineering ((LNEE,volume 571))

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Abstract

In millimeter wave (mm-wave) communication systems, large antenna array can be employed for higher data rates. Hybrid digital and analogue beamforming design is adopted to reduce the digital signal processing (DSP) power consumption and the circuitry complexity. In this paper, we investigate the multi-pair massive MIMO two-way relay networks with hybrid processing architecture. Furthermore, the power scaling scheme is also considered. We got some conclusions that when the number of antennas at relay station M goes huge, the asymptotic spectral efficiency can be obtained. We also compared three cases of power scaling schemes and obtained the optimal case specially when M tends to considerable large. We can draw the conclusion that when \(M\rightarrow \infty \), the Case 2 (only the transmit power of users scaled by M in power scaling schemes) is the optimal case compared with the other two cases. Finally, the Monte-Carlo is employed to demonstrate the validity of analytical results.

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Acknowledgement

This work is supported by the Postgraduate Research & Practice Innovation Program of Jiangnan University (JNKY19_059), the National Natural Science Foundation of China (No. 61571108 and No. 61701197 and No. 61801193), the open research fund of the National Mobile Communications Research Laboratory, Southeast University (No. 2018D15 and No. 2019D18), the open research fund of the National Key Laboratory of millimeter wave, Southeast University (No. K201918).

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Correspondence to Hongyan Wang .

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Wang, H. et al. (2020). Spectral Efficiency for Multi-pair Massive MIMO Two-Way Relay Networks with Hybrid Processing. In: Liang, Q., Wang, W., Liu, X., Na, Z., Jia, M., Zhang, B. (eds) Communications, Signal Processing, and Systems. CSPS 2019. Lecture Notes in Electrical Engineering, vol 571. Springer, Singapore. https://doi.org/10.1007/978-981-13-9409-6_298

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  • DOI: https://doi.org/10.1007/978-981-13-9409-6_298

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  • Publisher Name: Springer, Singapore

  • Print ISBN: 978-981-13-9408-9

  • Online ISBN: 978-981-13-9409-6

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