Abstract
As the core RF front-end device of wireless communication systems, the performance of millimeter wave power amplifier chips determines the communication distance/quality of the system. In order to improve the communication distance of the system, power amplifiers are often required to operate in a saturated state, which can cause severe warping and deformation of PA chips due to high temperature accumulation. This seriously affects the performance of RF front-end, and has become a key issue that needs to be urgently solved in the industry. This paper takes MATLAB as the core to build a Circuit-Electromagnetic-Thermal-Force Multiple Physical Field collaborative simulation and optimization platform. In HFSS, using vbs script to achieve fully parameterized modeling and full band circuit electromagnetic joint simulation. In ANSYS Workbench, thermodynamic simulation is implemented using SCDM and Mechanical in IronPython environment. In this paper, a PA chip based on GaN process is simulated by using the Multi-Physical Field collaborative simulation and optimization platform. Aiming at its high temperature agglomeration problem, the number and layout of transistor count are optimized, and the maximum temperature is successfully reduced by about 70 ℃. In order to compensate for the circuit performance degradation caused by layout, this paper built an automatic optimization platform to optimize it, and the gain increased by about 8.4 dB compared with that before optimization, which proved the availability, reliability and progressiveness of the multi-physical field collaborative simulation optimization platform.
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References
Liu, F., et al.: Innovative Sub-5- μ m microvias by picosecond UV laser for post-moore packaging interconnects. IEEE Trans. Components, Packaging Manuf. Technol. 9(10), 2016–2023 (2019)
Meneghini, M., et al.: Power GaN HEMT degradation: from time-dependent breakdown to hot-electron effects. In: 2018 IEEE International Electron Devices Meeting (IEDM), pp. 30.5.1–30.5.4. IEEE, San Francisco (2018)
Mahrokh, M., Yu, H., Guo, Y.: Thermal modeling of GaN HEMT devices with diamond heat-spreader. IEEE J. Electron. Devices Soc. 8, 986–991 (2020)
Duque, J.L., et al.: Multi-physics analysis of human exposition to electromagnetic fields by 5G systems. In: 2022 IEEE USNC-URSI Radio Science Meeting (Joint with AP-S Symposium), pp. 27–28. IEEE, Denver (2022)
Liu, X., Fan, M., Hu, Y., Li, H., Liu, F., Kang, J.: Simulation methods of multi-physics effects in nano-scale CMOS. In: 2022 International Electron Devices Meeting, pp. 15.4.1–15.4.4. IEEE, San Francisco (2022)
Na, W., Zhang, W., Yan, S., Feng, F., Zhang, W., Zhang, Y.: Automated neural network-based multiphysics parametric modeling of microwave components. IEEE Access 7, 141153–141160 (2019)
Rivière, N., Stokmaier, M., Goss, J.: An innovative multi-objective optimization approach for the multiphysics design of electrical machines. In: 2020 IEEE Transportation Electrification Conference & Expo (ITEC), pp. 691–696. IEEE, Chicago, IL, USA (2020)
Blair, C., López Ruiz, S., Morales, M.: A MultiPhysics simulation vision from antenna element design to systems link analysis. In: 2019 International Conference on Electromagnetics in Advanced Applications, pp. 1420–1422. IEEE, Granada, Spain (2019)
Jia, Z.L., Xue, Z.S., Liu, X.Y., Zhang, H.H.: Electromagnetic-circuital-thermal multiphysics simulation of microwave amplifier. In: 2022 Photonics & Electromagnetics Research Symposium, pp. 1155–1158. IEEE, Hangzhou (2022)
Guerrieri, S.D., Ramella, C., Catoggio, E., Bonani, F.: Variability-aware MMIC design through multiphysics modelling. In: 2022 IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization, pp. 1–4. IEEE, Limoges, France (2022)
Bello, H., Oyeleke, O., Usman, A.D., Bello, T., Muhammad, I., Zakariyya. O.S.: Modelling and realization of a compact CPW transmission lines using 3D mmics technology in ADS momentum. In: 2019 15th International Conference on Electronics, Computer and Computation (ICECCO), pp. 1–7. IEEE, Abuja, Nigeria (2019)
Niu, Z., Zhang, B., Fan, Y.: A 220GHz miniaturized integrated front end based on solid-state circuits. In: 2021 International Conference on Microwave and Millimeter Wave Technology, pp. 1–3. IEEE, Nanjing, China (2021)
Zhongwei, L., Zhaiqi.: Thermal stress analysis and optimization design of high temperature and high pressure valve based on the workbench. In: 2015 8th International Conference on Intelligent Computation Technology and Automation, pp. 1055–1058. IEEE, Nanchang, China (2015)
Lin, P., Jianqiang, C., Zhihao, Z., Yang, H., Tong, W., Gary, Z.: Design of broadband high-gain GaN MMIC power amplifier based on reactive/resistive matching and feedback technique. IEICE Electron. Express 18(19), 1–6 (2021)
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Li, Z. et al. (2024). Multi-physical Field Collaborative Simulation Optimization Technology and Reliability Analysis of Power Amplifiers. In: Jin, H., Pan, Y., Lu, J. (eds) Artificial Intelligence and Machine Learning. IAIC 2023. Communications in Computer and Information Science, vol 2058. Springer, Singapore. https://doi.org/10.1007/978-981-97-1277-9_20
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DOI: https://doi.org/10.1007/978-981-97-1277-9_20
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