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IC implementation challenges of a 2.4 GHz wireless LAN chipset

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Abstract

The recent introduction of IC technologies offering high frequency transistors withf t greater than 10 GHz has opened new opportunities for higher integration of wireless communication systems. Fast silicon IC devices make possible the integration of many RF subsystems on a single die and offer a total solution to mixed frequency (low frequency and RF) and mixed signal (analog and digital) systems. This paper describes IC implementation challenges of a 2.4 GHz wireless LAN chipset developed at Harris Semiconductor.

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Authors and Affiliations

  1. 32901, Melbourne, FL

    M. Chian (Harris Semiconductor), G. Croft, S. Jost, P. Landy, B. Myers & J. Prentice

  2. Integrated RF Solutions, 32909, Palm Bay, FL

    Doug Schultz

Authors
  1. M. Chian
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  2. G. Croft
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  3. S. Jost
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  4. P. Landy
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  5. B. Myers
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  6. J. Prentice
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  7. Doug Schultz
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Chian, M., Croft, G., Jost, S. et al. IC implementation challenges of a 2.4 GHz wireless LAN chipset. J VLSI Sign Process Syst Sign Image Video Technol 13, 143–163 (1996). https://doi.org/10.1007/BF01130403

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  • DOI: https://doi.org/10.1007/BF01130403

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