Skip to main content
Log in

Knowledge-directed inspection for complex multilayered patterns

  • Published:
Machine Vision and Applications Aims and scope Submit manuscript

Abstract

Combining the knowledge-based processing with image processing is considered a key issue in the future of visual inspection of complex patterns such as multilayered semiconductor wafers. However, present technology restricts this combination, mainly because of the exhaustively long time usually required for each type of processing. To cope with this situation, a unique knowledge-directed image processing method is proposed, in which every image processing step is controlled in real time by parametric knowledge driven by design patterns. The resulting structure of the image processor is a pipeline, in which each piece of knowledge is embodied as a combination of a hardware processing unit and control unit. In this paper the types of knowledge and their implementation are explained, and an inspection machine for logic IC wafers based on this pipelined knowledgedirected image processing is introduced.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Similar content being viewed by others

References

  • Awamura D, Nakashima K (1984) Defect inspection techniques for LSI wafer. Semiconductor World 3(6): 112–119 (in Japanese)

    Google Scholar 

  • Bruning JH, Feldman M, Kinsel TS, Sittig EK, Town-send RL (1975) An automated mask inspection system-AMIS. IEEE Transactions on Electron Devices ED-22(7):487–495

    Google Scholar 

  • Dom B et al. (1988) The P300: A system for automatic patterned wafer inspection. Machine Vision and Applications 1:205–221

    Google Scholar 

  • Ejiri M (1984) Views on robotics for future industry. In: Proceedings of Second International Symposium on Robotics Research, pp 166–172

  • Ejiri M, Uno T, Mese M, Ikeda S (1973) A process for detecting defects in complicated patterns. Computer Graphics and Image Processing 2(3/4):326–339

    Google Scholar 

  • Fusek RL, Harding K, Gustafson S. (1985) Holographic optical processing for submicrometer defect detection. Optical Engineering 24(5):731–734

    Google Scholar 

  • Goto N, Kondo T, Ichikawa K, Kanemoto M (1978) An automated inspection system for mask patterns. In: Proceedings of Fourth International Joint Conference on Pattern Recognition, pp 970–974

  • Hara Y (1987) Automating inspection of aluminum circuit patterns of LSI wafers. Electronics and Communication in Japan Part 2. 7(3):46–58

    Google Scholar 

  • Hara Y, Akiyama N, Karasaki K (1983) Automatic inspection system for printed circuit boards. IEEE Transactions on Pattern Analysis and Machine Intelligence PAMI-5(6):623–630

    Google Scholar 

  • Harris KL, Sandland P, Singleton RM (1983) Wafer inspection automation: Current and future system. Solid State Technology 26(8): 199–205

    Google Scholar 

  • Harris KL, Sandland P, Singleton RM (1984) Automated inspection of wafer patterns with applications in stepping, projection and direct-write lithography. Solid State Technology 27(2): 159–179

    Google Scholar 

  • Hsieh YY, Fu KS (1980) Automatic visual inspection of integrated circuit chips. Computer Graphics and Image Processing 14(4):293–343

    Google Scholar 

  • Jarvis JF (1980) A method for automating the visual inspection of printed wiring board. IEEE Transactions on Pattern Analysis and Machine Intelligence PAMI-2(1):77–82

    Google Scholar 

  • Konishi T, Misonou M, Katou T (1982) Surface defect inspection system for VLSI wafer. Journal of Institute of Television Engineers of Japan 36(1):38–44 (in Japannese)

    Google Scholar 

  • Pau LF (1983) Integrated testing and algorithms for visual inspection of integrated circuits. IEEE Transactions on Pattern Analysis and Machine Intelligence PAMI-5(6):602–608

    Google Scholar 

  • Yoda H, Ohuchi Y, Taniguchi Y, Ejiri M (1988) An automatic wafer inspection system using pipelined image processing techniques. IEEE Transactions on Pattern Analysis and Machine Intelligence PAMI-10(1):4–16

    Google Scholar 

Download references

Author information

Authors and Affiliations

Authors

Rights and permissions

Reprints and permissions

About this article

Cite this article

Ejiri, M., Yoda, H., Sakou, H. et al. Knowledge-directed inspection for complex multilayered patterns. Machine Vis. Apps. 2, 155–166 (1989). https://doi.org/10.1007/BF01212456

Download citation

  • Issue Date:

  • DOI: https://doi.org/10.1007/BF01212456

Key words

Navigation