Zusammenfassung
Die Qualifikation von Halbleiterbauelementen, die ihren Einsatz in der Automobilindustrie finden, basiert auf den international akzeptierten Standards AEC-Q100 und Q101. Da die Anforderungen im Automobilbereich jedoch bezüglich Zuverlässigkeit, Lebensdauer und Applikationsbedingungen immer härter werden, reicht diese Qualifikationsmethodik allein nicht mehr aus, um die Bauteile für die Anwendung im Automobil freizugeben. Im vorliegenden Artikel werden neue Qualifikationsansätze und hochlaufbegleitende Maßnahmen beschrieben. Anhand eines Beispiels aus einer Machbarkeitsstudie für ein neues Halbleitergehäuse im Hause Infineon Technologies wird gezeigt, wie wichtig Belastungstests sind, die über die AEC-Q100-Anforderungen hinausgehen.
Summary
The qualification of semiconductor devices for automotive applications is based on a qualification procedure described in the AEC-Q100 and Q101 which are internationally accepted standards. As the requirements regarding reliability, lifetime and application conditions for automotive electronics are increasing dramatically this qualification method is not sufficient anymore to release the devices for the application in the car. In the following article new concepts for qualification and safe launch measures will be described. With the data resulting from a feasibility study for a new semiconductor package at Infineon Technologies the importance of extended stress tests beyond the AEC-Q100 will be shown.
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Müller, V., Lewitschnig, H., Kortik, N. et al. Quality assurance in automotive electronics. Elektrotech. Inftech. 128, 371–374 (2011). https://doi.org/10.1007/s00502-011-0048-y
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DOI: https://doi.org/10.1007/s00502-011-0048-y