Skip to main content
Log in

A novel defect detection and identification method in optical inspection

  • Original Article
  • Published:
Neural Computing and Applications Aims and scope Submit manuscript

Abstract

Optical inspection techniques have been widely used in industry as they are non-destructive. Since defect patterns are rooted from the manufacturing processes in semiconductor industry, efficient and effective defect detection and pattern recognition algorithms are in great demand to find out closely related causes. Modifying the manufacturing processes can eliminate defects, and thus to improve the yield. Defect patterns such as rings, semicircles, scratches, and clusters are the most common defects in the semiconductor industry. Conventional methods cannot identify two scale-variant or shift-variant or rotation-variant defect patterns, which in fact belong to the same failure causes. To address these problems, a new approach is proposed in this paper to detect these defect patterns in noisy images. First, a novel scheme is developed to simulate datasets of these 4 patterns for classifiers’ training and testing. Second, for real optical images, a series of image processing operations have been applied in the detection stage of our method. In the identification stage, defects are resized and then identified by the trained support vector machine. Adaptive resonance theory network 1 is also implemented for comparisons. Classification results of both simulated data and real noisy raw data show the effectiveness of our method.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Fig. 1
Fig. 2
Fig. 3
Fig. 4
Fig. 5
Fig. 6
Fig. 7
Fig. 8

Similar content being viewed by others

References

  1. Chou PB, Rao AR, Struzenbecker MC, Wu FY, Brecher VH (1997) Automatic defect classification for semiconductor manufacturing. Mach Vis Appl 9(4):201–214

    Article  Google Scholar 

  2. Cho H, Park WS (2002) Neural network applications in automated optical inspection: state of the arts, algorithms and systems for optical information processing VI. In: Javidi B, Psaltis D (eds) Proceedings of SPIE, vol 4789

  3. Moganti M, Ercal F (1998) A subpattern level inspection system for printed circuit boards. Comput Vis Underst 70(1):51–62

    Article  Google Scholar 

  4. Ken R, Brain S, Neil H (1991) Using full wafer defect maps as process signatures to monitor and control yield. IEEE/SEMI semiconductor manufacturing science symposium, pp 129–135

  5. Chen FL, Liu SF (2000) A neural-network approach to recognize defect spatial pattern in semiconductor fabrication. IEEE Trans Semicond Manuf 13(3):366–373

    Article  Google Scholar 

  6. Liu SF, Chen FL, Lu WB (2002) Wafer bin map recognition using a neural network approach. Int J Prod Res 40(10):2207–2223

    Article  MATH  Google Scholar 

  7. Cunningam SP, MacKinnon S (1998) Statistical methods for visual defect methodology. IEEE Trans Semicond Manuf 11:48–53

    Article  Google Scholar 

  8. Chien CF, Wang WC, Cheng JC (2007) Data mining for yield enhancement in semiconductor manufacturing and an empirical study. Expert Syst Appl 33(1):192–198

    Article  Google Scholar 

  9. Hsieh HW, Chen FL (2004) Recognition of defect spatial patterns in semiconductor fabrication. Int J Prod Res 42(19):4153–4172

    Article  Google Scholar 

  10. Wang CH, Wang SJ, Lee WD (2006) Automatic identification of spatial defect patterns for semiconductor manufacturing. Int J Prod Res 44(23):5169–5185

    Article  MATH  Google Scholar 

  11. Jeong Y, Kim S, Jeong MK (2008) Automatic identification of defect patterns in semiconductor wafer maps using spatial correlogram and dynamic time warping. IEEE Trans Semicond Manuf 21(4):625–637

    Article  MathSciNet  Google Scholar 

  12. Gu N, Cao Z, Xie L, Tan M, Nahavandi S (2012) Identification of concurrent control chart patterns with singular spectrum analysis and learning vector quantization network. J Intell Manuf. doi:10.1007/s10845-012-0659-0

    Google Scholar 

  13. Hu J, Chen J, Sundararaman S, Chandrashekhara K (2009) Finite element analysis of V-ribbed belt/pulley system with pulley misalignment using a neural network based material model. Neural Comput Appl 18(8):927–938

    Article  Google Scholar 

  14. Zhao D, Wang Y, Lin Z, Sheng S (2013) An effective quality assessment method for small scale resistance spot welding based on process parameters. NDT&E International. doi:10.1016/j.ndteint.2013.01.008

    Google Scholar 

  15. Wang Q, Cao C, Li M, Zu H (2013) A new model based on grey theory and neural network algorithm for evaluation of aids clinical trial. Adv Comput Math Appl 2(3):292–297

    Google Scholar 

  16. Su CT, Yang T, Ke CM (2002) A neural-network for semiconductor wafer post-sawing inspection. IEEE Trans Semicond Manuf 15:260–266

    Article  Google Scholar 

  17. Huang CJ (2007) Clustered defect detection of high quality chips using self-supervised multilayer perceptron. Expert Syst Appl 33:996–1003

    Article  Google Scholar 

  18. Lee JH, Yu SJ, Park SC (2001) A new intelligent SOFM-based sampling plan for advanced process control. Expert Syst Appl 20:133–151

    Article  Google Scholar 

  19. DeNicolao G, Pasquinetti E, Miraglia G, Piccinini F (2003) Unsupervised spatial pattern classification of electrical failures in semiconductor manufacturing, workshop on Artificial Neural Networks in Pattern Recognition, pp 125–131

  20. Palma F, DeNicolao G, Miraglia G, Pasquinetti E, Piccinini F (2005) Unsupervised spatial pattern classification of electrical-wafer-sorting maps in semiconductor manufacturing. Pattern Recogn Lett 26(12):1857–1865

    Article  Google Scholar 

  21. Choi G, Kim SH, Ha C, Bae SJ (2012) Multi-step ART1 algorithm for recognition of defect patterns on semiconductor wafers. Int J Prod Res 50(12):3274–3287

    Article  Google Scholar 

  22. Wang CH (2009) Separation of composite defect patterns on wafer bin map using support vector clustering. Expert Syst Appl I(2):2554–2561

    Article  Google Scholar 

  23. Wang CH (2008) Recognition of semiconductor defect patterns using spatial filtering and spectral clustering. Expert Syst Appl 34(3):1914–1923

    Article  Google Scholar 

  24. Burges CJC (1998) A tutorial on support vector machines for pattern recognition. Data Min Knowl Discovery 2(2):955–974

    Article  Google Scholar 

  25. Xie L, Li D, Simske SJ (2011) Feature dimensionality reduction for example-based image super-resolution. J Pattern Recogn Res 2:130–139

    Article  Google Scholar 

  26. Song H, Choi KK, Lee I, Zhao L, Lamb D (2013) Adaptive virtual support vector machine for the reliability analysis of high-dimensional problems. Struct Multidisciplinary Optim 47(4):479–491

    Article  MathSciNet  MATH  Google Scholar 

  27. Xie L, Gu N, Li D, Cao Z, Tan M, Nahavandi S (2013) Concurrent control chart patterns recognition with singular spectrum analysis and support vector machine. Comput Ind Eng 64(1):280–289

    Article  Google Scholar 

  28. Li TS, Huang CL (2009) Defect spatial pattern recognition using a hybrid SOM–SVM approach in semiconductor manufacturing. Exp Syst Appl 36(1):374–385

    Article  Google Scholar 

  29. Chao LC, Tong LI (2009) Wafer defect pattern recognition by multi-class support vector machines by using a novel defect cluster index. Exp Syst Appl 36(6):10158–10167

    Article  Google Scholar 

  30. Platt JC, Shawe-Taylor J, Cristianini N (2000) Large Margin DAGs for Multiclass Classification. In: Solla SA, Leen TK, Muller KR (eds). MIT Press, pp 547–553

  31. Weston J, Watkins C (1998) Multi-class support vector machines, Technical report CSD-TR-98-04

  32. Gonzalez RC, Richard E (2001) Woods, digital image processing, 2nd edn. Prentice Hall, Englewood Cliffs

    Google Scholar 

  33. Xie L, Gu N, Cao Z, Li D (2013) A hybrid approach for multiple particle tracking microrhelogy. Int J Adv Robot Syst 10. doi: 10.5772/54364.

Download references

Author information

Authors and Affiliations

Authors

Corresponding author

Correspondence to Liangjun Xie.

Rights and permissions

Reprints and permissions

About this article

Cite this article

Xie, L., Huang, R., Gu, N. et al. A novel defect detection and identification method in optical inspection. Neural Comput & Applic 24, 1953–1962 (2014). https://doi.org/10.1007/s00521-013-1442-7

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s00521-013-1442-7

Keywords

Navigation