Abstract
The embedded Flash (eFlash) technology can be subject to defects creating functional faults. In this paper, we first generalize the electrical model of the ATMEL TSTAC™ eFlash memory technology proposed in [10]. The model is composed of two layers: a functional layer representing the Floating Gate (FG) and a programming layer able to determine the channel voltage level controlling the Fowler-Nordheim tunneling effect. The proposed model is validated by means of simulations and comparisons with ATMEL silicon data. Then, we present a complete analysis of actual resistive defects (open and short) that may affect the ATMEL TSTAC™ eFlash array by considering the proposed model on a hypothetical 4 × 4 array. This analysis highlights the interest of the proposed model to provide a realistic set of fault models that has to be tested, thus enhancing existing solutions for TSTAC™ eFlash testing.
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Responsible Editor: C. A. Papachristou
This paper is an extended version of a previously published paper. Main contributions of this paper with respect to [10] are:
-A generalization of the model initially proposed in [10] to the case of multiple word-lines, -A complete analysis of actual resistive defects (open and short) that may affect the ATMEL TSTAC/ eFlash array, -A fault modeling of actual resistive defect injection.
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Mauroux, PD., Virazel, A., Bosio, A. et al. Analysis and Fault Modeling of Actual Resistive Defects in ATMEL eFlash Memories. J Electron Test 28, 215–228 (2012). https://doi.org/10.1007/s10836-012-5277-4
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DOI: https://doi.org/10.1007/s10836-012-5277-4