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A Review of Various Defects in PCB

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Abstract

Printed Circuit Boards (PCBs) are the building blocks for all electronic products. Fabrication of a PCB involves various mechanical and chemical processes. As obtaining accuracy in the mechanical and chemical processes is very difficult, various defects/faults are formed during PCBs fabrication. These fabrication defects lead to performance degradation of electronic products. In this review, we describe various defects present in PCBs under the Through hole and SMD categories. To understand the frequency of occurrence and reason for the occurrence of defects in both manual and machine, PCB fabrication data was collected and analysed from April 2017 to July 2020 as a part of industry collaboration.

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Data sharing not applicable to this article as no datasets were generated or analysed during the current study.

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Acknowledgment

We thank Efftronics Systems Pvt. Ltd. for their constant support, figures and discussions in working on this project.

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Authors and Affiliations

  1. Department of ECE, SRM University-AP, Amaravati, India

    V. Udaya Sankar, Gayathri Lakshmi & Y. Siva Sankar

Authors
  1. V. Udaya Sankar
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  2. Gayathri Lakshmi
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  3. Y. Siva Sankar
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Correspondence to V. Udaya Sankar.

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Responsible Editor: S. Sindia

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Sankar, V.U., Lakshmi, G. & Sankar, Y.S. A Review of Various Defects in PCB. J Electron Test 38, 481–491 (2022). https://doi.org/10.1007/s10836-022-06026-7

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  • DOI: https://doi.org/10.1007/s10836-022-06026-7

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