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A Weighted-Bin Difference Method for Issue Site Identification in Analog and Mixed-Signal Multi-Site Testing

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Abstract

Higher complexity in recent chip designs, module integration, and increasing test quality requirements have expanded measurement needs and further increased chip test costs. Multi-site testing (parallel measurement) solves this issue by taking test measurements from multiple chips simultaneously, massively increasing throughput, and significantly reducing the test time per chip. Massive multi-site testing system, a setup with significant measurement site count, further improves throughput and maximizes gains. However, it unavoidably amplifies site-to-site variations in the measured specifications. This problem is particularly magnified in analog and mixed-signal chips. Some measurement sites now exhibit pronounced induced errors, and their measurements no longer reflect the actual performance of the device under test (DUT). This problem presents a solid need to identify sites that suffer from extreme site-to-site variations (issue sites). We propose an automated method to investigate site-to-site variations in volume multi-site data and identify issue sites that may not be obvious via human inspection or basic statistical methods. Assuming that all measurement sites have the same accuracy and precision, we consider an issue site to be one whose weighted-bin difference score is greater than an analytically derived upper bound. We apply the proposed method to simulation data and volume test data obtained from an industrial analog and mixed-signal system on chips (SoCs) that were tested using multi-site testing hardware and show that the technique can effectively identify issue sites in the testing system. We compare the proposed algorithm to existing methods and demonstrate its superior performance.

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Data Availability

The data that support the findings of this study are available from Texas Instruments Inc, but restrictions apply to the availability of these data, which were used under license for the current study, and so are not publicly available. Data are however, available from the authors upon reasonable request and with permission of Texas Instruments Inc.

References

  1. Nourani M, Chin J (2002) Testing high-speed SoCs using low-speed ATEs. Proceedings 20th IEEE VLSI Test Symposium (VTS 2002), Monterey, CA, USA, pp 133–138. https://doi.org/10.1109/VTS.2002.1011124

    Book  Google Scholar 

  2. Chaganti SK, Chen T, Zhuang Y, Chen D (2018) Low-cost and accurate DAC linearity test with ultrafast segmented model identification of linearity errors and removal of measurement errors (uSMILE-ROME). 2018 IEEE International Instrumentation and Measurement Technology Conference (I2MTC), Houston, TX, pp 1–6. https://doi.org/10.1109/I2MTC.2018.8409877

    Book  Google Scholar 

  3. Duan Y, Chen T, Chen D (2016) Low-cost dithering generator for accurate ADC linearity test. 2016 IEEE International Symposium on Circuits and Systems (ISCAS), Montréal, QC, Canada, pp 1474–1477. https://doi.org/10.1109/ISCAS.2016.7527536

    Book  Google Scholar 

  4. Chen T, Chen D (2015) Ultrafast stimulus error removal algorithm for ADC linearity test. 2015 IEEE 33rd VLSI Test Symposium (VTS), Napa, CA, USA, pp 1–5. https://doi.org/10.1109/VTS.2015.7116249

    Book  Google Scholar 

  5. Chen T et al (2020) A low-cost on-chip built-in self-test solution for adc linearity test. IEEE Trans Instrum Meas 69(6):3516–3526. https://doi.org/10.1109/TIM.2019.2936716

    Article  Google Scholar 

  6. Manzone A, Bernardi P, Grosso M, Rebaudengo M, Sanchez E, Reorda MS (2005) Integrating BIST techniques for on-line SoC testing. 11th IEEE International On-Line Testing Symposium, French Riviera, France, pp 235–240. https://doi.org/10.1109/IOLTS.2005.38

    Book  Google Scholar 

  7. Khoo VC (2014) A case study on the effectiveness of multi-sites test handler to improve of production output. IOSR J Eng 4(4):47–59. https://doi.org/10.9790/3021-04454759

    Article  Google Scholar 

  8. Rivoir J (2003) Lowering cost of test: parallel test or low-cost ATE? Proceedings of the 7th International Conference on Properties and Applications of Dielectric Materials (Cat No 03CH37417) ATS-03, Xi’an, China, pp 360–363. https://doi.org/10.1109/ATS.2003.1250837

    Book  Google Scholar 

  9. reducing_test. Reducing IC test costs through multisite and concurrent testing. https://www.techdesignforums.com/practice/technique/reduce-test-costs-multisite-concurrent-testing/. Accessed 3 Oct 2020

  10. Kim H, Lee Y, Kang S (2015) A novel massively parallel testing method using multi-root for high reliability. IEEE Trans Reliab 64(1):486–496. https://doi.org/10.1109/TR.2014.2336395

    Article  Google Scholar 

  11. Han D, Lee Y, Kang S (2014) A new multi-site test for system-on-chip using multi-site star test architecture. ETRI J 36(2):293–300. https://doi.org/10.4218/etrij.14.0113.0469

    Article  Google Scholar 

  12. Lehner T, Kuhr A, Wahl M, Bruck R (2014) Site dependencies in a multisite testing environment. 2014 19th IEEE European Test Symposium (ETS), Paderborn, Germany, pp 1–6. https://doi.org/10.1109/ETS.2014.6847808

    Book  Google Scholar 

  13. Kian LB (2006) Test cost saving and challenges in the implementation of /spl times/6 and /spl times/8 parallel testing on freescale 16-bit HCS12 microcontroller product family. Third IEEE International Workshop on Electronic Design, Test and Applications (DELTA’06), Kuala Lumpur, Malaysia, pp 7–82. https://doi.org/10.1109/DELTA.2006.85

    Book  Google Scholar 

  14. Khasawneh Q, Dworak J, Gui P, Williams B, Elliott AC, Muthaiah A (2018) Real-time monitoring of test fallout data to quickly identify tester and yield issues in a multi-site environment. 2018 IEEE 36th VLSI Test Symposium (VTS), San Francisco, CA, pp 1–6. https://doi.org/10.1109/VTS.2018.8368661

    Book  Google Scholar 

  15. Says AI (2021) Coping with parallel test site-to-site variation. Semicond Eng. https://semiengineering.com/coping-with-parallel-test-site-to-site-variation/. Accessed 5 May 2022

  16. Farayola PO, Chaganti SK, Obaidi AO, Sheikh A, Ravi S, Chen D (2020) Quantile – quantile fitting approach to detect site to site variations in massive multi-site testing. 2020 IEEE 38th VLSI Test Symposium (VTS), pp 1–6. https://doi.org/10.1109/VTS48691.2020.9107616

    Book  Google Scholar 

  17. Farayola PO, Chaganti SK, Obaidi AO, Sheikh A, Ravi S, Chen D (2021) Detection of site to site variations from volume measurement data in multisite semiconductor testing. IEEE Trans Instrum Meas 70:1–12. https://doi.org/10.1109/TIM.2021.3051666

    Article  Google Scholar 

  18. Wold S, Esbensen K, Geladi P. Principal component analysis. p 16

  19. Rosenberg D. 1 distances between probability measures. p 4

  20. Acharya J, Luo M. An algorithmic and information-theoretic toolbox for massive data. p 5

  21. Butler KM, Nahar A, Daasch WR (2016) What we know after twelve years developing and deploying test data analytics solutions. 2016 IEEE International Test Conference (ITC), pp 1–8. https://doi.org/10.1109/TEST.2016.7805844

    Book  Google Scholar 

  22. Ho Y-C, Zhao Q-C, Jia Q-S (2007) Ordinal optimization: soft optimization for hard problems. Springer, New York

    Book  MATH  Google Scholar 

  23. Farayola PO, Bruce I, Chaganti SK, Sheikh A, Ravi S, Chen D (2021) Massive multisite variability-aware die distribution estimation for analog/mixed-signal circuits test validation. 2021 16th International Conference on Design Technology of Integrated Systems in Nanoscale Era (DTIS), pp 1–6. https://doi.org/10.1109/DTIS53253.2021.9505144

    Book  Google Scholar 

  24. Bruce I et al (2021) An ordinal optimization-based approach to die distribution estimation for massive multi-site testing validation: a case study. 2021 IEEE European Test Symposium (ETS), pp 1–4. https://doi.org/10.1109/ETS50041.2021.9465402

    Book  Google Scholar 

  25. Steinley D (2006) K-means clustering: a half-century synthesis. Br J Math Stat Psychol 59(1):1–34. https://doi.org/10.1348/000711005X48266

    Article  MathSciNet  Google Scholar 

  26. Kruskal William H, Allen Wallis W (1952) Use of ranks in one-criterion variance analysis. J Am Stat Assoc 47(260):583–621. https://doi.org/10.1080/01621459.1952.10483441

    Article  MATH  Google Scholar 

  27. Mood AM (1920) Introduction to the theory of statistics, 3rd edn. http://archive.org/details/in.ernet.dli.2015.132521. Accessed 21 Feb 2021

  28. Farayola PO et al (2021) Systematic hardware error identification and calibration for massive multisite testing. IEEE International Test Conference (ITC), Anaheim, CA, USA, pp 304–308. https://doi.org/10.1109/ITC50571.2021.00042

    Book  Google Scholar 

  29. Farayola PO, Bruce I, Chaganti SK, Sheikh A, Ravi S, Chen D (2022) The least-squares approach to systematic error identification and calibration in semiconductor multisite testing. 2022 IEEE 40th VLSI Test Symposium (VTS), San Diego, CA, USA, pp 1–7. https://doi.org/10.1109/VTS52500.2021.9794216

    Book  Google Scholar 

  30. Daasch WR, McNames J, Bockelman D, Cota K (2000) Variance reduction using wafer patterns in I/sub ddQ/ data. Proceedings International Test Conference 2000 (IEEE Cat. No.00CH37159), Atlantic City, NJ, USA, pp 189–198. https://doi.org/10.1109/TEST.2000.894206

    Book  Google Scholar 

  31. Daasch WR, McNames J, Madge R, Cota K (2002) Neighborhood selection for I/sub DDQ/ outlier screening at wafer sort. IEEE Des Test Comput 19(5):74–81. https://doi.org/10.1109/MDT.2002.1033795

    Article  Google Scholar 

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Acknowledgments

This work was supported in part by Texas Instruments and in part by the Semiconductor Research Corporation.

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Correspondence to Isaac Bruce.

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Bruce, I., Farayola, P.O., Chaganti, S.K. et al. A Weighted-Bin Difference Method for Issue Site Identification in Analog and Mixed-Signal Multi-Site Testing. J Electron Test 39, 57–69 (2023). https://doi.org/10.1007/s10836-023-06047-w

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