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An empirical study of design-of-experiment data mining for yield-loss diagnosis for semiconductor manufacturing

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Abstract

To maintain competitive advantages, semiconductor industry has strived for continuous technology migrations and quick response to yield excursion. As wafer fabrication has been increasingly complicated in nano technologies, many factors including recipe, process, tool, and chamber with the multicollinearity affect the yield that are hard to detect and interpret. Although design of experiment (DOE) is a cost effective approach to consider multiple factors simultaneously, it is difficult to follow the design to conduct experiments in real settings. Alternatively, data mining has been widely applied to extract potential useful patterns for manufacturing intelligence. However, because hundreds of factors must be considered simultaneously to accurately characterize the yield performance of newly released technology and tools for diagnosis, data mining requires tremendous time for analysis and often generates too many patterns that are hard to be interpreted by domain experts. To address the needs in real settings, this study aims to develop a retrospective DOE data mining that matches potential designs with a huge amount of data automatically collected in semiconductor manufacturing to enable effective and meaningful knowledge extraction from the data. DOE can detect high-order interactions and show how interconnected factors respond to a wide range of values. To validate the proposed approach, an empirical study was conducted in a semiconductor manufacturing company in Taiwan and the results demonstrated its practical viability.

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References

  • Berry, M., & Linoff, G. (1997). Data mining techniques for marketing, sales and customer support. New York, NY: Wiley.

    Google Scholar 

  • Braha, D., & Shmilovici, A. (2002). Data mining for improving a cleaning process in the semiconductor industry. IEEE Transactions on Semiconductor Manufacturing, 15(1), 91–101.

    Article  Google Scholar 

  • Braha, D., & Shmilovici, A. (2003). On the use of decision tree induction for discovery of interactions in a photolithographic process. IEEE Transactions on Semiconducter Manufacturing, 16(4), 644–652.

    Google Scholar 

  • Chen, W., & Chien, C.-F. (2011). Measuring relative performance of wafer fabrication operations: A case study. Journal of Intelligent Manufacturing, 22(3), 447–457.

    Article  Google Scholar 

  • Chien, C.-F., & Chen, C. (2007a). A novel timetabling algorithm for a furnace process for semiconductor fabrication with constrained waiting and frequency-based setups. OR Spectrum, 29(3), 391–419.

    Google Scholar 

  • Chien, C.-F., & Chen, L. (2007b). Using rough set theory to recruit and retain high-potential talents for semiconductor manufacturing. IEEE Transactions on Semiconductor Manufacturing, 20(4), 528–541.

    Google Scholar 

  • Chien, C.-F., & Chen, L. (2008). Data mining to improve personnel selection and enhance human capital: A case study in high-technology industry. Expert Systems with Applications, 34(1), 280–290.

    Article  Google Scholar 

  • Chien, C.-F., Chen, Y., & Peng, J. (2010). Manufacturing intelligence for semiconductor demand forecast based on technology diffusion and product life cycle. International Journal of Production Economics, 128(2), 496–509.

    Article  Google Scholar 

  • Chien, C.-F., Dauzere-Peres, S., Ehm, H., Fowler, J. W., Jiang, Z., Krishnaswamy, S., et al. (2011). Modeling and analysis of semiconductor manufacturing in a shrinking world: Challenges and successes. European Journal of Industrial Engineering, 5(3), 254–271.

    Article  Google Scholar 

  • Chien, C.-F., & Hsu, C. (2006). A novel method for determining machine subgroups and backups with an empirical study for semiconductor manufacturing. Journal of Intelligent Manufacturing, 17(4), 429–439.

    Article  Google Scholar 

  • Chien, C.-F., & Hsu, C. (2011). UNISON analysis to model and reduce step-and-scan overlay errors for semiconductor manufacturing. Journal of Intelligent Manufacturing, 22(3), 399–412.

    Article  Google Scholar 

  • Chien, C.-F., Hsu, C., & Chang, K. (2013a). Overall wafer effectiveness (OWE): A novel industry standard for semiconductor ecosystem as a whole. Computers & Industrial Engineering, 65(1), 117–127.

    Google Scholar 

  • Chien, C.-F., Hsu, C., & Hsiao, C. (2012a). Manufacturing intelligence to forecast and reduce semiconductor cycle time. Journal of Intelligent Manufacturing, 23(6), 2281–2294.

    Google Scholar 

  • Chien, C.-F., Hsu, S., & Chen, Y. (2013b). A system for online detection and classification of wafer bin map defect patterns for manufacturing intelligence. International Journal of Production Research, 51(8), 2324–2338.

    Google Scholar 

  • Chien, C.-F., Wang, W., & Cheng, J. (2007). Data mining for yield enhancement in semiconductor manufacturing and an empirical study. Expert System with Applications, 33(1), 192–198.

    Article  Google Scholar 

  • Chien, C.-F., Wu, C., & Chiang, Y. (2012b). Coordinated capacity migration and expansion planning for semiconductor manufacturing under demand uncertainties. International Journal of Production Economics, 135(2), 860–869.

    Google Scholar 

  • Chien, C.-F., & Zheng, J.-N. (2012). Mini-max regret strategy for robust capacity expansion decisions in semiconductor manufacturing. Journal of Intelligent Manufacturing, 23(6), 2151–2159.

    Article  Google Scholar 

  • Coleman, D. E., Montgomery, D. C., Gunter, B. H., Hahn, G. J., Haaland, P. D., O’Connell, M. A., et al. (1993). A systematic approach to planning for a designed industrial experiment. Technometrics, 35, 1–27.

    Article  Google Scholar 

  • Dunn, O. J. (1964). Multiple comparisons using rank sums. Technometrics, 6(3), 241–252.

    Article  Google Scholar 

  • Fayyad, U., Piatetsky-Shapiro, G., & Smyth, P. (1996). The KDD process for extracting useful knowledge from volumes of data. Communication of the ACM, 39(11), 27–34.

    Article  Google Scholar 

  • Han, J., & Kamber, M. (2001). Data mining: Concepts and techniques. San Francisco, CA: Morgan Kaufmann Publishers.

    Google Scholar 

  • Harding, J. A., Shahbaz, M., Srinivas, & Kusiak, A. (2006). Data mining: A review. Journal of Manufacturing Science and Engineering, 128(4), 969–976.

    Article  Google Scholar 

  • Holm, S. (1979). A simple sequentially rejective multiple test procedure. Scandinavian Journal of Statistics, 6(2), 65–70.

    Google Scholar 

  • Hsu, S., & Chien, C.-F. (2007). Hybrid data mining approach for pattern extraction from wafer bin map to improve yield in semiconductor manufacturing. International Journal of Production Economics, 107(1), 88–103.

    Article  Google Scholar 

  • Hwang, J. Y., & Kuo, W. (2007). Model-based clustering for integrated circuit yield enhancement. European Journal of Operational Research, 178(1), 143–153.

    Article  Google Scholar 

  • Jeong, Y., Kim, S., & Jeong, M. (2008). Automatic identification of defect patterns in semiconductor wafer maps using spatial correlogram and dynamic time warping. IEEE Transactions on Semiconducter Manufacturing, 21(4), 625–637.

    Article  Google Scholar 

  • Khuri, A. I., & Cornell, J. A. (1996). Response surfaces designs and analyses. New York: Marcel Dekker.

    Google Scholar 

  • Kruskal, W. H., & Wallis, W. A. (1952). Use of ranks on one-criterion variance analysis. Journal of the American Statistical Association, 47(260), 583–621.

    Article  Google Scholar 

  • Kuo, C., Chien, C.-F., & Chen, C. (2011). Manufacturing intelligence to exploit the value of production and tool data to reduce cycle time. IEEE Transactions on Automation Science and Engineering, 8(1), 103–111.

    Article  Google Scholar 

  • Kusiak, A., & Kurasek, C. (2001). Data mining of printed-circuit board defects. IEEE Transactions on Robotics and Automation, 17(2), 191–196.

    Article  Google Scholar 

  • Liu, C.-W., & Chien, C.-F. (2013). An intelligent system for wafer bin map defect diagnosis: An empirical study for semiconductor manufacturing. Engineering Applications of Artificial Intelligence, 26(5–6), 1479–1486.

    Google Scholar 

  • Marcus, R., Peritz, E., & Gabriel, K. R. (1976). On closed testing procedures with special reference to ordered analysis of variance. Biometrika, 63, 655–660.

    Article  Google Scholar 

  • May, G. S., Huang, J., & Spanos, C. J. (1991). Statistical experiment design in plasma etch modeling. IEEE Transactions on Semiconductor Manufacturing, 4(2), 83–98.

    Google Scholar 

  • Montgomery, D. C. (2005). Design and analysis of experiments (6th ed.). New York, NY: Wiley.

    Google Scholar 

  • Moore, G. E. (1965). Cramming more components onto integrated circuits. Electronics, 38(8), 114–117.

    Google Scholar 

  • Wu, C. F. J., & Hamada, M. (2000). Experiments: Planning, analysis, and parameter design optimization. New York, NY: Wiley.

    Google Scholar 

  • Wu, J., & Chien, C.-F. (2008). Modeling strategic semiconductor assembly outsourcing decisions based on empirical settings. OR Spectrum, 30(3), 401–430.

    Google Scholar 

  • Wu, J.-Z. (2013). Inventory write-down prediction for semiconductor manufacturing considering inventory age, accounting principle, and product structure with real settings. Computers & Industrial Engineering, 65(1), 128–136.

    Google Scholar 

  • Wu, J.-Z., Hao, X.-C., Chien, C.-F., & Gen, M. (2012). A novel bi-vector encoding genetic algorithm for the simultaneous multiple resources scheduling problem. Journal of Intelligent Manufacturing, 23(6), 2255–2270.

    Article  Google Scholar 

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Acknowledgments

This research is partially supported by National Science Council, Taiwan (NSC99-2221-E-007-047-MY3; NSC102-2622-E-007-013), National Tsing Hua University under the Toward World-Class University Project (101N2073E1), and Macronix International Ltd. (93A0309J8) in Taiwan.

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Correspondence to Chen-Fu Chien.

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Chien, CF., Chang, KH. & Wang, WC. An empirical study of design-of-experiment data mining for yield-loss diagnosis for semiconductor manufacturing. J Intell Manuf 25, 961–972 (2014). https://doi.org/10.1007/s10845-013-0791-5

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  • DOI: https://doi.org/10.1007/s10845-013-0791-5

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