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Monitoring of a machining process using kernel principal component analysis and kernel density estimation

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Abstract

Tool wear is one of the consequences of a machining process. Excessive tool wear can lead to poor surface finish, and result in a defective product. It can also lead to premature tool failure, and may result in process downtime and damaged components. With this in mind, it has long been desired to monitor tool wear/tool condition. Kernel principal component analysis (KPCA) is proposed as an effective and efficient method for monitoring the tool condition in a machining process. The KPCA-based method may be used to identify faults (abnormalities) in a process through the fusion of multi-sensor signals. The method employs a control chart monitoring approach that uses Hotelling’s T2-statistic and Q-statistic to identify the faults in conjunction with control limits, which are computed by kernel density estimation (KDE). KDE is a non-parametric technique to approximate a probability density function. Four performance metrics, abnormality detection rate, false detection rate, detection delay, and prediction accuracy, are employed to test the reliability of the monitoring system and are used to compare the KPCA-based method with PCA-based method. Application of the proposed monitoring system to experimental data shows that the KPCA based method can effectively monitor the tool wear.

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Acknowledgements

The authors would like to acknowledge the NASA repository for publishing and hosting the milling data used in the paper. This work is supported by the Wabash Heartland Innovation Network (WHIN), the Indiana Next Generation Manufacturing Competitiveness Center (IN-MaC), and the U.S. National Science Foundation (Grant No. 1512217). Any opinions, findings, conclusions, and/or recommendations expressed are those of the authors and do not necessarily reflect the views of the funding agencies.

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Correspondence to Wo Jae Lee.

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Lee, W.J., Mendis, G.P., Triebe, M.J. et al. Monitoring of a machining process using kernel principal component analysis and kernel density estimation. J Intell Manuf 31, 1175–1189 (2020). https://doi.org/10.1007/s10845-019-01504-w

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  • DOI: https://doi.org/10.1007/s10845-019-01504-w

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