Abstract
In recent years, as one of the new advanced manufacturing modes, cloud manufacturing has been received wide attentions around the world. The technology of cloud manufacturing intergrades the services-oriented techniques as well as manufacturing processes based on cloud computing. With the aid of the cloud computing platforms, the manufacturing services are provided in manufacturing clouds. However, one of the key challenges of cloud manufacturing is the security and safety of information transmission. Traditional network security architectures are based on RSA and elliptic curve cryptographic systems, which is claimed to be broken on quantum computers. We exploit the countermeasures of post-quantum algorithms to protect cloud manufacturing against quantum computer attacks. We propose a post-quantum secure scheme for cloud manufacturing. First, in order to retain confidentiality in cloud manufacturing, we propose a post-quantum asymmetric-key encryption scheme to encrypt the message with the generated session key. Second, in order to retain authentication security in cloud manufacturing, we propose a post-quantum public-key signature generation scheme. Third, based on the encryption scheme and signature generation scheme, we propose a post-quantum secure communication system for cloud manufacturing. We implement our design on cloud-based environment and the comparison with related designs show that our design is suitable for protecting communication in cloud manufacturing. Besides, the post-quantum secure communication system can be extended to other applications of intelligent manufacturing.
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Acknowledgements
The authors acknowledge Natural Science Foundation of Guangdong Province, China (No. 2018A030310030), Foundation for Distinguished Young Talents in Higher Education of Guangdong, China (No. 2017GkQNCX059), Special funds for Shenzhen Strategic Emerging Industries and Future Industrial Development (No. 20170502142224600).
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Yi, H. A post-quantum secure communication system for cloud manufacturing safety. J Intell Manuf 32, 679–688 (2021). https://doi.org/10.1007/s10845-020-01682-y
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DOI: https://doi.org/10.1007/s10845-020-01682-y