Abstract
In the semiconductor manufacturing field, few studies on fault detection (FD) models have considered process drift due to incomplete maintenance. Process drift refers to the shift in sensor measurements over time due to tool aging, and it leads to defective production when it is severe. Tool maintenance is conducted regularly to prevent defects. However, when it is performed improperly, tool aging accelerates, and the drift increases. In this paper, we propose an FD model robust to process drift by modeling process drift with a variational autoencoder (VAE). Because process drift is characterized by time-varying information, the proposed model encodes some time-varying information through separate hidden layers. By adopting a strategy that combines information separately encoded in a feature vector, the proposed model successfully models process drift. With actual chemical vapor deposition process data, we were able to generate many virtual datasets that incorporate process drift with various drift characteristics, such as patterns, degrees, and speeds. The proposed model outperformed four comparison FD methods on these datasets.






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References
An, J., & Cho, S. (2015). Variational autoencoder based anomaly detection using reconstruction probability. Special Lecture on IE, 2(1), 1–18. https://doi.org/10.1007/BF00758335
Du, X. (2019). Fault detection using bispectral features and one-class classifiers. Journal of Process Control, 83, 1–10. https://doi.org/10.1016/j.jprocont.2019.08.007
Gan, F. F. (1992). CUSUM control charts under linear drift. Journal of the Royal Statistical Society. Series D (The Statistician), 41(1), 71–84. https://doi.org/10.2307/2348638
García, V., Sánchez, J. S., Rodríguez-Picón, L. A., Méndez-González, L. C., & de Ochoa-Domínguez, H. (2019). Using regression models for predicting the product quality in a tubing extrusion process. Journal of Intelligent Manufacturing, 30(6), 2535–2544. https://doi.org/10.1007/s10845-018-1418-7
Hassan, A. H., Lambert-Lacroix, S., & Pasqualini, F. (2015). Real-time fault detection in semiconductor using one-class support vector machines. International Journal of Computer Theory and Engineering, 7(3), 191. https://doi.org/10.7763/IJCTE.2015.V7.955
He, Q. P., & Wang, J. (2010). Large-scale semiconductor process fault detection using a fast pattern recognition-based method. IEEE Transactions on Semiconductor Manufacturing, 23(2), 194–200. https://doi.org/10.1109/TSM.2010.2041289
Jang, J., Min, B. W., & Kim, C. O. (2019). Denoised residual trace analysis for monitoring semiconductor process faults. IEEE Transactions on Semiconductor Manufacturing, 32(3), 293–301. https://doi.org/10.1109/TSM.2019.2916374
Jeng, J. C. (2010). Adaptive process monitoring using efficient recursive PCA and moving window PCA algorithms. Journal of the Taiwan Institute of Chemical Engineers, 41(4), 475–481. https://doi.org/10.1016/j.jtice.2010.03.015
Jia, F., Lei, Y., Lin, J., Zhou, X., & Lu, N. (2016). Deep neural networks: A promising tool for fault characteristic mining and intelligent diagnosis of rotating machinery with massive data. Mechanical Systems and Signal Processing, 72, 303–315. https://doi.org/10.1016/j.ymssp.2015.10.025
Khatab, A. (2018). Maintenance optimization in failure-prone systems under imperfect preventive maintenance. Journal of Intelligent Manufacturing, 29(3), 707–717. https://doi.org/10.1007/s10845-018-1390-2
Kim, C., Lee, J., Kim, R., Park, Y., & Kang, J. (2018). DeepNAP: Deep neural anomaly pre-detection in a semiconductor fab. Information Sciences, 457, 1–11. https://doi.org/10.1016/j.ins.2018.05.020
Kingma, D. P., & Max, W. (2013). Auto-encoding variational bayes. arXiv:1312.6114 (preprint)
Ko, J. M., & Kim, C. O. (2012). A multivariate parameter trace analysis for online fault detection in a semiconductor etch tool. International Journal of Production Research, 50(23), 6639–6654. https://doi.org/10.1080/00207543.2011.611538
LeCun, Y., & Bengio, Y. (1995). Convolutional networks for images, speech, and time series. The Handbook of Brain Theory and Neural Networks, 3361(10), 255–258. https://doi.org/10.1109/IJCNN.2004.1381049
Lee, H., Kim, Y., & Kim, C. O. (2017a). A Deep Learning Model for Robust Wafer Fault Monitoring With Sensor Measurement Noise. IEEE Transactions on Semiconductor Manufacturing, 30(1), 23–31. https://doi.org/10.1109/TSM.2016.2628865
Lee, K. B., Cheon, S., & Kim, C. O. (2017b). A convolutional neural network for fault classification and diagnosis in semiconductor manufacturing processes. IEEE Transactions on Semiconductor Manufacturing, 30(2), 135–142. https://doi.org/10.1109/TSM.2017.2676245
Lee, K. B., & Kim, C. O. (2020). Recurrent feature-incorporated convolutional neural network for virtual metrology of the chemical mechanical planarization process. Journal of Intelligent Manufacturing, 31(1), 73–86. https://doi.org/10.1007/s10845-018-1437-4
Lee, T., & Kim, C. O. (2015). Statistical comparison of fault detection models for semiconductor manufacturing processes. IEEE Transactions on Semiconductor Manufacturing, 28(1), 80–91. https://doi.org/10.1109/TSM.2014.2378796
Lee, W. J., Mendis, G. P., Triebe, M. J., & Sutherland, J. W. (2020). Monitoring of a machining process using kernel principal component analysis and kernel density estimation. Journal of Intelligent Manufacturing, 31(5), 1175–1189. https://doi.org/10.1007/s10845-019-01504-w
Liao, W., Pan, E., & Xi, L. (2010). Preventive maintenance scheduling for repairable system with deterioration. Journal of Intelligent Manufacturing, 21(6), 875–884. https://doi.org/10.1007/s10845-009-0264-z
Liu, Q., & Lv, W. (2015). Multi-component manufacturing system maintenance scheduling based on degradation information using genetic algorithm. Industrial Management & Data Systems, 115(8), 1412–1434. https://doi.org/10.1108/IMDS-04-2015-0150
Moyne, J., & Iskandar, J. (2017). Big data analytics for smart manufacturing: Case studies in semiconductor manufacturing. Processes. https://doi.org/10.3390/pr5030039
Romain, A. C., & Nicolas, J. (2010). Long term stability of metal oxide-based gas sensors for e-nose environmental applications: An overview. Sensors and Actuators, B: Chemical, 146(2), 502–506. https://doi.org/10.1016/j.snb.2009.12.027
Ruff, L., Vandermeulen, R., Goernitz, N., Deecke, L., Siddiqui, S. A., Binder, A., et al. (2018). Deep one-class classification. In International conference on machine learning (pp. 4393–4402). PMLR.
Sakurada, M., & Yairi, T. (2014). Anomaly detection using autoencoders with nonlinear dimensionality reduction. In Proceedings of the MLSDA 2014 2nd Workshop on Machine Learning for Sensory Data Analysis (pp. 4–11). https://doi.org/10.1145/2689746.2689747
Santos, P., Maudes, J., & Bustillo, A. (2018). Identifying maximum imbalance in datasets for fault diagnosis of gearboxes. Journal of Intelligent Manufacturing, 29(2), 333–351. https://doi.org/10.1007/s10845-015-1110-0
Sheriff, M. Z., Mansouri, M., Karim, M. N., Nounou, H., & Nounou, M. (2017). Fault detection using multiscale PCA-based moving window GLRT. Journal of Process Control, 54, 47–64. https://doi.org/10.1016/j.jprocont.2017.03.004
Snoek, J., Larochelle, H., & Adams, R. P. (2012). Practical bayesian optimization of machine learning algorithms. Advances in Neural Information Processing Systems, 25
Sohn, K., Lee, H., & Yan, X. (2015). Learning structured output representation using deep conditional generative models. Advances in Neural Information Processing Systems, 28, 3483–3491.
Wang, T., Qiao, M., Zhang, M., Yang, Y., & Snoussi, H. (2020). Data-driven prognostic method based on self-supervised learning approaches for fault detection. Journal of Intelligent Manufacturing, 31(7), 1611–1619. https://doi.org/10.1007/s10845-018-1431-x
Wang, Z. Q., Hu, C. H., & Fan, H. D. (2018). Real-time remaining useful life prediction for a nonlinear degrading system in service: application to bearing data. IEEE/ASME Transactions on Mechatronics, 23(1), 211–222. https://doi.org/10.1109/TMECH.2017.2666199
Wise, B. M., Gallagher, N. B., Butler, S. W., White, D. D., & Barna, G. G. (1999). A comparizon of principal component analysis, multiway principal component analysis, trilinear decomposition and parallel factor analysis for fault detection in a semiconductor etch process. Journal of Chemometrics, 13(3–4), 379–396. https://doi.org/10.1002/(SICI)1099-128X(199905/08)13:3/4%3c379::AID-CEM556%3e3.0.CO;2-N
Yan, K., & Zhang, D. (2016). Correcting instrumental variation and time-varying drift: A transfer learning approach with autoencoders. IEEE Transactions on Instrumentation and Measurement, 65(9), 2012–2022. https://doi.org/10.1109/TIM.2016.2573078
Ye, F., Zhang, Z., Xia, Z., Zhou, Y., & Zhang, H. (2019). Monitoring and diagnosis of multi-channel profile data based on uncorrelated multilinear discriminant analysis. International Journal of Advanced Manufacturing Technology, 103(9–12), 4659–4669. https://doi.org/10.1007/s00170-019-03912-x
Yue, X., Yan, H., Park, J. G., Liang, Z., & Shi, J. (2018). A wavelet-based penalized mixed-effects decomposition for multichannel profile detection of in-line raman spectroscopy. IEEE Transactions on Automation Science and Engineering, 15(3), 1258–1271. https://doi.org/10.1109/TASE.2017.2772218
Acknowledgements
This work was supported by National Research Foundation of Korea (NRF) grants funded by the Korean government (MSIT) (NRF-2019R1A2B5B01070358) and ICONS (Institute of Convergence Science), Yonsei University.
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Kim, Y., Lee, H. & Kim, C.O. A variational autoencoder for a semiconductor fault detection model robust to process drift due to incomplete maintenance. J Intell Manuf 34, 529–540 (2023). https://doi.org/10.1007/s10845-021-01810-2
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DOI: https://doi.org/10.1007/s10845-021-01810-2