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Cloud-Integrated Cyber-Physical Systems for Complex Industrial Applications

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Abstract

Recently, with many advances in wireless sensor networks, big data, mobile and cloud computing, Cyber-Physical Systems (CPS) can tightly couple cyber space with the physical world better than ever before. Also, the cloud-based systems can provide massive storage resources and low-cost computing as well as the flexibility of customizing the operating environment to Complex Industrial Applications (CIA). In our view, Cloud-integrated CPS (CCPS) will open the door to allow previously unachievable application scenarios to be built, deployed, managed and controlled effectively. In this paper, we propose a novel architecture of CCPS (termed CCPSA) and outline the enabling technologies for CIA. Then, we dissect three potential challenges and provide solutions from the perspective of CIA, including virtualized resource management techniques, the scheduling of cloud resources, and life cycle management. We hope this paper can provide insight and a roadmap for future research efforts in the emerging field of CCPS.

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Acknowledgements

This work is partially supported by National Natural Science Foundations of China (Nos. 61572220, 61262013, 51575194, 61472283 and 61103185), the Fundamental Research Funds for the Central Universities (Nos. 2015ZZ079, 2013KJ034, 2100219043 and 1600219246), the Natural Science Foundation of Guangdong Province, China (No. 2015A030313746), the Fok Ying-Tong Education Foundation, China (Grant No. 142006), and the Scientific Research Foundation for the Returned Overseas Chinese Scholars, State Education Ministry.

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Correspondence to Jiafu Wan.

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This work is based in part on our previous paper titled “An Insight into Cloud-enabled Complex Industrial Applications,” Presented at the fourth IEEE/CIC International Conference on Communications in China (ICCC 2015), Shenzhen, China, November, 2015.

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Shu, Z., Wan, J., Zhang, D. et al. Cloud-Integrated Cyber-Physical Systems for Complex Industrial Applications. Mobile Netw Appl 21, 865–878 (2016). https://doi.org/10.1007/s11036-015-0664-6

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