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Fast and efficient extraction algorithm for high-speed interconnects with arbitrary boundaries

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Abstract

In this paper, we present an accurate and general interconnect model for planar transmission line interconnects with arbitrary boundary conditions. Based on the unified approach, we develop a SPICE-compatible parameter extraction algorithm that can be used in high-performance computer-aided-design applications. A range of multilayered interconnect geometries with arbitrary boundaries are analyzed. Different typical configurations of ground placement are considered to verify the applicability of this method. For all such cases, results are compared for admittance, line parameters, and delay giving physical insight on the effect of boundary conditions on them. Compared with existing industry standard numerical field-solvers, like HFSS, the proposed model demonstrates more than 10× speedup within 2% accuracy.

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References

  1. Paul CR (2007) Analysis of multiconductor transmission lines, 2nd edn. Wiley/IEEE Press, New York

    Google Scholar 

  2. Edwards TC, Steer MB (2001) Foundations of interconnect and microstrip design, 3rd edn. Wiley, New York

    Google Scholar 

  3. Fan J et al (2010) Signal integrity design for high-speed digital circuits: progress and directions. IEEE Trans Electromagn Compat 52(2):392–400

    Article  Google Scholar 

  4. Li E-P et al (2010) Progress review of electromagnetic compatibility analysis technologies for packages, printed circuit boards, and novel interconnects. IEEE Trans Electromagn Compat 52(2):248–265

    Article  Google Scholar 

  5. Sharma R, Chakravarty T, Bhattacharyya AB (2009) Analytical modeling of microstrip-like interconnects in presence of ground plane aperture. IEE Proc, Microw Antennas Propag 3(1):14–22

    Article  Google Scholar 

  6. Sharma R, Chakravarty T, Bhattacharyya AB (2009) Analytical model for optimum signal integrity in PCB interconnects using ground tracks. IEEE Trans Electromagn Compat 51(1):67–77

    Article  Google Scholar 

  7. Zhang T, Sapatnekar SS (2007) Simultaneous shield and buffer insertion for crosstalk noise reduction in global routing. IEEE Trans Very Large Scale Integr (VLSI) Syst 15(6):624–636

    Article  Google Scholar 

  8. Zhang J, Friedman EG (2006) Crosstalk modeling for coupled RLC interconnects with application to shield insertion. IEEE Trans Very Large Scale Integr (VLSI) Syst 14(6):641–646

    Article  Google Scholar 

  9. Cohn SB (1960) Characteristic impedances of broadside-coupled strip transmission lines. IRE Trans Microw Theory Tech 8(6):633–637

    Article  Google Scholar 

  10. Diaz RE (1986) The discrete variational conformal technique for the calculation of strip transmission line parameters. IEEE Trans Microw Theory Tech 34(6):714–722

    Article  Google Scholar 

  11. Yook JG, Dib NI, Raheti LPB (1994) Characterization of high frequency interconnects using finite difference time domain and finite element method. IEEE Trans Microw Theory Tech 42(9):1727–1736

    Article  Google Scholar 

  12. Kammler DW (1968) Calculation of characteristic admittances and coupling coefficients for strip transmission lines. IEEE Trans Microw Theory Tech 16(11):925–937

    Article  Google Scholar 

  13. Bhat B, Koul SK (1982) Unified approach to solve a class of strip and microstrip-like transmission lines. IEEE Trans Microw Theory Tech 30(5):679–686

    Article  Google Scholar 

  14. Itoh T, Mittra R (1974) A technique for computing dispersion characteristics of shielded microstrip lines. IEEE Trans Microw Theory Tech 22(10):896–898

    Article  Google Scholar 

  15. Levy R (1980) Conformal transformations combined with numerical techniques, with applications to coupled-bar problems. IEEE Trans Microw Theory Tech 28(4):369–375

    Article  Google Scholar 

  16. Smith JI (1971) The even- and odd-mode capacitance parameters for coupled lines in suspended substrate. IEEE Trans Microw Theory Tech 19(5):424–431

    Article  Google Scholar 

  17. Green HE (1965) The numerical solution of some important transmission-line problems. IEEE Trans Microw Theory Tech 13(5):676–692

    Article  Google Scholar 

  18. Sharma R, Choi K (2010) A formal approach toward developing an equivalent circuit for high-speed coupled interconnects with intermediate ground insertion. In: Proceedings of the Asia symposium on quality electronic design, pp 324–331

    Chapter  Google Scholar 

  19. Sharma R, Chakravarty T, Choi K (2011) Generalized parameter extraction model for high-speed interconnects with arbitrary boundary conditions. In: Proceedings of the 30th URSI general assembly, pp 1–4

    Google Scholar 

  20. Cao Y et al (2005) Impact of on-chip interconnect frequency-dependent R(f)L(f) on digital and RF design. IEEE Trans Very Large Scale Integr (VLSI) Syst 13(1):158–162

    Article  Google Scholar 

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Authors and Affiliations

  1. Interconnect Focus Center, Georgia Institute of Technology, Atlanta, USA

    Rohit Sharma

  2. Tata Consultancy Services, Kolkata, India

    T. Chakravarty

  3. School of Electrical Engineering and Computer Science, Seoul National University, Seoul, Korea

    K. Choi

Authors
  1. Rohit Sharma
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  2. T. Chakravarty
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  3. K. Choi
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Correspondence to Rohit Sharma.

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Sharma, R., Chakravarty, T. & Choi, K. Fast and efficient extraction algorithm for high-speed interconnects with arbitrary boundaries. J Supercomput 62, 251–264 (2012). https://doi.org/10.1007/s11227-011-0713-2

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  • DOI: https://doi.org/10.1007/s11227-011-0713-2

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