Abstract
Although many Dynamic Thermal Management (DTM) techniques are employed to overcome thermal problems in 3D NoCs, none of them consider temperature information of all nodes of a layer at the same time, so that they cannot reduce the temperature of the network properly.To overcome this problem, this paper proposes an efficient proactive thermal-aware routing algorithm, called Less Entrance to Hot Regions (LETHOR), to keep the NoC temperature lower than a predefined thermal limit. LETHOR routes the network packets based on the temperature information of all nodes in the layers instead of considering only the neighbor nodes in each hop. To this aim, LETHOR introduces a Hot Region in each layer based on the gathered temperature information to determine the suitable routing path. Based on the gathered information, LETHOR examines available paths and selects the cooler and less crowded one. Experimental results show that the LETHOR routing algorithm decreases the standard deviation of chip temperature by 13.24–47.40% and the statistical traffic load distribution by 13.62–48.34%, under different traffic patterns. Moreover, the global average delay is reduced by 23.07–44.13% under different traffic patterns compared to the state-of-the-art routing algorithm.














Similar content being viewed by others
References
Lee SC, Han TH (2020) Q-function-based traffic-and thermal-aware adaptive routing for 3d network-on-chip. Electronics 9(3):392–409
Halavar B, Talawar Basavaraj (2020) Power and performance analysis of 3d network-on-chip architectures. Comput Electr Eng 83(1):1–12
Fu Y, Chen Q, He G, Chen K, Lut Z, Zhang C, Li L (2019) Congestion-aware dynamic elevator assignment for partially connected 3d-nocs. In: IEEE International Symposium on Circuits and Systems (ISCAS), pp. 1–5
Charif A, Coelho A, Ebrahimi M, Bagherzadeh N, Zergainoh NE (2018) First-last: a cost-effective adaptive routing solution for tsv-based three-dimensional networks-on-chip. IEEE Trans Comput (TC) 67(10):1430–1444
Salamat R, Khayambashi M, Ebrahimi M, Bagherzadeh N (2018) Lead: an adaptive 3d-noc routing algorithm with queuing-theory based analytical verification. IEEE Trans Comput(TC) 67(8):1153–1166
Zou T, Zhang C, Peng X, Peng Y (2018) An inter-layer-distance based routing algorithm for 3d network-on-chip. In: CCF National Conference on Computer Engineering and Technology, pp. 26–37
Sivakumar P, Pandiaraj K, JeyaPrakash K (2019) Optimization of thermal aware multilevel routing for 3d ic. Analog Integr Circuits Signal Process 103(1):131–142
Taheri E, Mohammadi K, Patooghy Ahmad (2019) On-off: a reactive routing algorithm for dynamic thermal management in 3d nocs. IET Comput Dig Tech (CDT) 13(1):11–19
Majumdar A, Dash Ranjita K, Risco-Martnn Jos L, Turuk Ashok K (2018) Fmotar: a fast multi-objective thermal-aware routing algorithm for three-dimensional network-on-chips. In: Proceeding of the 50th Computer Simulation Conference, Society for Computer Simulation International (SummerSim), pp. 12–24
Liu CY, Chen YJ, Hariyama M (2020) Thermal-aware memory system synthesis for mpsocs with 3d-stacked hybrid memories. In: Proceedings of the 35th annual ACM symposium on applied computing (SAC), pp. 546–553
Dash R, Majumdar A, Pangracious V, Turuk AK, Risco-Martn J L (2018) Atar: an adaptive thermal-aware routing algorithm for 3-d network-on-chip systems. IEEE Trans Compon Packag Manuf Tech (TCPMT) 8(12):1–8
Li B, Wang X, Singh AK, Mak T (2019) On runtime communication and thermal-aware application mapping and defragmentation in 3d noc systems. IEEE Trans Parallel Distrib Syst (TPDS) 30(12):2775–2789
Rohbani N, Shirmohammadi Z, Zare M, Miremadi Seyyed-Ghassem (2017) Laxy: a location-based aging-resilient xy-yx routing algorithm for network on chip. IEEE Trans Comput-Aided Des Integr Circuits Syst(TCAD) 36(10):1725–1738
Shirmohammadi Z, Miremadi SG (2014) Using binary-reflected gray coding for crosstalk mitigation of network on chip. In: The 17th CSI International Symposium on Computer Architecture & Digital Systems (CADS 2013), pp 81–86
Shirmohammadi Z, Miremadi SG (2015) Addressing NoC reliability through an efficient fibonaccibased crosstalk avoidance codec design. In: Proceedings of IEEE International Conference Algorithms and Architectures for Parallel Proc, pp 756–770
Shirmohammadi Z, Mahdavi Z (2018) An efficient and low power one-lambda crosstalk avoidance code design for network on chips. In: Microprocessors and Microsystems (MICPRO), vol 63
Manna K, Mathew J (2020) Thermal-aware application mapping strategy for designing a 2d noc-based multi-core systems. In: Design and test strategies for 2D/3D integration for NoC-based multicore architectures, pp. 87–109
Manna K, Mathew J (2020) Thermal-aware design strategies for the 3d noc-based multi-core systems. In: Design and test strategies for 2D/3D integration for NoC-based multicore architectures, pp. 111–123
Shang L, Peh LS, Kumar A, Jha Niraj K (2004) Thermal Modeling, Characterization and management of on-chip networks. In: Proceedings of the 37th Annual IEEE/ACM International Symposium on Microarchitecture (MICRO), pp. 67–78
Bharathi S, Suganthi M, Gowrison Gengavel (2020) Crosstalk minimization in network on chip (noc) links with dual binary weighted code codec. J Ambient Intell Humaniz Comput 12(5):4603–4608
Taheri E, Patooghy A, Karim M (2016) Xyz-zyx: a minimal routing algorithm for dynamic thermal management in 3d nocs. In: 24th Iranian Conference on Electrical Engineering (ICEE), pp 1539–1534
Majumdar A, Dash Ranjita K, Pangracious V, Turuk Ashok K (2017) An efficient multi-objective thermal aware routing algorithm 3d network-on-chips. In: International Conference on Electrical and Computing Technologies and Applications (ICECTA), pp. 1–4
Salamat R, Khayambashi M, Ebrahimi M, Bagherzadeh N (2016) A resilient routing algorithm with formal reliability analysis for partially connected 3d-nocs. IEEE Trans Comput (TC) 65(11):3265–3279
Lin SY, Yin TC, Wang HY, An-Yeu W (2011) Traffic-and thermal-aware routing for throttled three-dimensional network-on-chip systems. In: Proceedings of the IEEE International Symposium on VLSI Design, Automation and Test (VLSI-DAT), pp. 1–4
Chao CH, Chen KC, Yin TC, Lin SY, An-Yeu Wu (2013) Transport-layer-assisted routing for runtime thermal management of 3d noc systems. ACM Trans Embed Comput Syst (TECS) 13(1):11–22
Chen KC, Lin SY, Hung HS, Wu AY (2012) Traffic-balanced topology-aware multiple routing adjustment for throttled 3d noc systems. In: Proceedings of the IEEE Workshop on Signal Processing Systems (SiPS), pp. 120–124
Chao CH, Jheng KY, Wang HY, Wu JC, Wu AY (2010) Traffic- and thermal-aware run-time thermal management scheme for 3d noc system. In: Proceedings of the ACM/IEEE International Symposium on Networks-On-Chip (NOCS), pp. 223–230
Chen KC, Kuo CC, Hung HS, Wu AY (2013) Traffic- and thermal-aware adaptive beltway routing for three dimensional network-on-chip systems. In: Proceedings of the IEEE International Symposium on Circuits and Systems (ISCAS), pp. 1660–1663
Al-Dujaily R, Dahir N, Mak T, Xia F, Yakovlev A (2013) Dynamic programming-based runtime thermal management (dprtm): an online thermal control strategy for 3d-noc systems. ACM Trans Des Autom Electron Syst (TODAES) 19(1):11–22
Chen Kun-Chih (2018) Game-based thermal-delay-aware adaptive routing (gtdar) for temperature-aware 3d network-on-chip systems. IEEE Trans Parallel Distrib Syst 29(9):1–16
Jheng KY, Chao CH, Wang HY, Wu AY (2010) Traffic-thermal mutual-coupling co-simulation platform for three-dimensional network-on-chip. In: Proceedings of the IEEE International Symposium on VLSI Design, Automation, and Test (VLSI–DAT), pp. 135–13
Lee SC, HanHan Tae Hee (2020) Q-function-based traffic-and thermal-aware adaptive routing for 3d network-on-chip. Electronics 9(3):392–409
Safari M, Shirmohammadi Z, Rohbani N, Farbeh H (2018) Floating xy-yx: an efficient thermal management routing algorithm for 3d nocs. In: Proceeding of the 16th IEEE International Conference on Dependable, Autonomic and Secure Computing (DASC), pp. 1–6
Matsutani H, Koibuchi M, Amano H (2007) Tightly-coupled multi-layer topologies for 3-d nocs. In: International Conference on Parallel Processing (ICPP), pp. 75–85
Catania V, Mineo A, Monteleone S, Palesi M, Patti D (2016) Cycle-accurate network on chip simulation with noxim. ACM Trans Model Comput Simul (TOMACS) 27(1):1–25
Huang W, Sankaranarayanan K, Ribando Robert J, Stan Mircea R, Skadron K (2007) An improved block-based thermal model in hotspot 4.0 with granularity considerations. In: In proceedings of the Workshop on Duplicating, Deconstructing, and Debunking, pp. 135–138
Hoskote AM, Vangal K, Singh Kameswar R, Borkar P (2007) A 5-ghz mesh interconnect for a teraflops processor. In IEEE Micro, pp. 51–61
Liu W, Xu Jiang X, Wu X, Ye Y, Wang X, Zhang W, Nikdast M, Wang Z (2011) A noc traffic suite based on real applications. In: IEEE Computer Society Annual Symposium on VLSI (ISVLSI), pp. 66–71
Bahmani M, Sheibanyrad A, Petrot F, Dubois F, Durante P (2012) A 3d-noc router implementation exploiting vertically-partially-connected topologies. In: IEEE Computer Society Annual Symposium on VLSI, pp. 9–14
Acknowledgment
This work was supported by Shahid Rajaee Teacher Training Univesity.
Author information
Authors and Affiliations
Corresponding author
Additional information
Publisher's Note
Springer Nature remains neutral with regard to jurisdictional claims in published maps and institutional affiliations.
Rights and permissions
About this article
Cite this article
Safari, M., Shirmohammadi, Z., Rohbani, N. et al. LETHOR: a thermal-aware proactive routing algorithm for 3D NoCs with less entrance to hot regions. J Supercomput 78, 1–25 (2022). https://doi.org/10.1007/s11227-021-04207-3
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s11227-021-04207-3