Abstract
This paper describes the development and fabrication of a modular eddy current micro sensor on a flexible polymer foil. Due to handling purposes during the micro sensor fabrication process the modular eddy current micro sensors are fabricated on a temporary Si substrate. To enable a release of the micro sensors at the end of the fabrication process, initial investigations concentrated on the proof of principle applying a deep reactive-ion etching (DRIE) process to structure the Si wafer. The DRIE process was used to structure Si frames, which serve as carriers for the modular micro sensors. For the evaluation of the fabricated eddy current micro sensors, electrical resistance measurements were accomplished with the integrated anisotropic magneto-resistance (AMR) sensor. The aim of these investigations was to evaluate the influence of the substrate material on the characteristics of the AMR sensor. The electrical output signal of these micro sensors were subsequently compared to electrical resistance measurements of identical AMR sensors fabricated on a Si substrate and served as reference. To prove the capability of the completed eddy current micro sensors, a defect in form of a scratch was created on the surface of a Cu probe and investigated by eddy current testing. The electrical output signal of the eddy current micro sensor was subsequently compared to an optical measurement of the surface profile of this scratch. There is a high correlation between the optical measurements and the signal of the eddy current micro sensor.








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References
Denkena B, Hasenfuß K, Liedtke C (2005) Genetik und Intelligenz in der Produktions-technik. In: Spur G (ed) ZWF Zeitschrift fuer wirtschaftlichen Fabrikbetrieb, vol 100, no. 10, pp 569–572
Hansen S, Rissing L, Gatzen, HH (2007) A concept for a toolbox of components for modular magnetic microsensors. Symposium on magnetic materials, processes and devices, 210th meeting of the electrochemical society 2006, ecs transactions 3(25):235–246
Griesbach T, Rissing L, Gatzen HH (2008) Concept for the integration of a temperature sensor in the modular, multifunctional micro sensor family.In: 4th I*PROMS virtual international conference on innovative production machines and systems, 1–14 July, pp 472–476
Yamada S, Chomsuwan K, Hagino T, Iwahara M, Tian H (2004) Metallic bead detection by using eddy-current probe with SV-GMR sensor. Papers of Technical Meeting on Magnetics, IEE Japan, vol MAG-04, No. 144–156, pp 19–22
Griesbach T, Wurz MC, Rissing L (2011) Application of sacrificial layers for the modular micro sensor fabrication on a flexible polymer substrate. In: Sensor+test conference 2011, sensor proceedings, Nuernberg, Germany, pp 355–360
Rissing L, Griesbach T (2011) Struktureinrichtung mit einem Bauelement, Vorrichtung zur Applikation des Bauelements, Verfahren zur Herstellung der Struktureinrichtung und Verfahren zur Applikation des Bauelements. German patent application 10 2011 108 981.4
Griesbach T, Wurz MC, Rissing L (2011) Modular eddy current micro sensor. IEEE Trans Magn 47(10):3760–3763
Griesbach T, Wurz MC, Rissing L (2011) Design and fabrication of a modular eddy current micro sensor. In: Progress in electromagnetics research symposium (PIERS 2011), Marrakesh, Morocco, PIERS proceedings 29th, pp 752–755
Acknowledgments
This research is sponsored in part by the German Research Foundation (DFG) within the Collaborative Research Center (SFB) 653 “Gentelligent Components in their lifecycle”.
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Griesbach, T., Wurz, M.C. & Rissing, L. Development, fabrication, and test of a modular eddy current micro sensor on a flexible polymer foil. Prod. Eng. Res. Devel. 7, 3–8 (2013). https://doi.org/10.1007/s11740-012-0415-5
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DOI: https://doi.org/10.1007/s11740-012-0415-5