Skip to main content
SpringerLink
Log in

Splash suppression during wafer wet cleaning through drop penetration across metal meshes and porous fiber mats

  • Regular Paper
  • Published:
Journal of Visualization Aims and scope Submit manuscript

Abstract

Semiconducting silicon wafers were subjected to centrifugal wet cleaning to remove micro-contaminants. The circular wafers were rotated while a cleaning liquid was supplied to the wafer surface. During such a cleaning process, the centrifugal force atomizes the liquid film at the wafer edges, producing drops. These drops travel in the confined chamber, collide with the chamber walls, and form splashed droplets. Thereafter, the splashed droplets return to the wafer, thereby significantly increasing the risk of re-contamination. Given this wafer wet cleaning scenario, we experimentally investigated the trajectories of splashed droplets. We introduced metal mesh filtration and air-blowing techniques to minimize wafer re-contamination by the splashed droplets. The metal mesh decreased the speed of the drops, thus minimizing the intensity of splashing. The droplets were also air-blown with a supersonic stream to deflect the droplets from their trajectories and thus prevent them from reaching the wafer. The optimal air-blowing condition was determined through parametric studies. The metal mesh was electroplated with copper, producing textured surfaces on the mesh wires. In addition, the metal fiber mats were laminated on the metal mesh and the effects of these on splashing were studied. Further, photographs of droplets spreading and splashing over these metal meshes were captured to elucidate their detailed dynamics. Time-series snapshots of drops penetrating the metal meshes were also captured.

Graphic abstract

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Fig. 1
Fig. 2
Fig. 3
Fig. 4
Fig. 5
Fig. 6
Fig. 7
Fig. 8
Fig. 9
Fig. 10
Fig. 11

Similar content being viewed by others

Abbreviations

d 1 :

Distance from impact location to sensitive paper (horizontal) (mm)

d 2 :

Distance from disk edge to mesh (horizontal) (mm)

D :

The spreading diameter (mm)

DM:

Double layer meshes

D drop :

Diameter of drop (mm)

D 0 :

Initial diameter of drop (mm)

D p :

Mesh pore size (mm)

D w :

Mesh wire diameter (mm)

EP:

Electroplating

h 1 :

Gap between mesh and acrylic wall (vertical) (mm)

h 2 :

Gap between sensitive paper bottom edge and disk top (vertical) (mm)

h 3 :

Distance between liquid nozzle exit to disk top (vertical) (mm)

H 1 :

Distance between liquid nozzle exit to mesh (vertical) (cm)

H 2 :

Distance between supersonic air nozzle to disk top (vertical) (cm)

N :

The number of multiple drops

N m :

The number of meshes

Re:

Reynolds number

SM:

Single layer mesh

t :

Interval time (s)

u i :

Drop impact speed (m/s)

W :

Drop impact speed (%)

We:

Weber number

γ :

Geometric ratio, γ = 1 + Dw/Dp

ρ :

Liquid density (kg/m3)

μ :

Liquid dynamic viscosity (N s/m2)

σ :

Liquid surface tension (N/m)

References

  • An S, Lee C, Liou M, Jo HS, Park J-J, Yarin AL et al (2014) Supersonically blown ultrathin thorny devil nanofibers for efficient air cooling. ACS Appl Mater Interfaces 6(16):13657–13666

    Article  Google Scholar 

  • An S, Jo HS, Kim DY, Lee HJ, Ju BK, Al-Deyab SS et al (2016) Self-junctioned copper nanofiber transparent flexible conducting film via electrospinning and electroplating. Adv Mater 28(33):7149–7154

    Article  Google Scholar 

  • Boscariol C, Chandra S, Sarker D, Crua C, Marengo M (2018) Drop impact onto attached metallic meshes: liquid penetration and spreading. Exp Fluids 59(12):189

    Article  Google Scholar 

  • Chandrasekhar S (1981) Hydrodynamic and hydromagnetic stability. Dover Publications, Mineola

    MATH  Google Scholar 

  • Drazin PG, Reid WH (2004) Hydrodynamic stability. Cambridge University Press, Cambridge

    Book  Google Scholar 

  • Hattori T, Osaka T, Okamoto A, Saga K, Kuniyasu H (1998) Contamination removal by single-wafer spin cleaning with repetitive use of ozonized water and dilute HF. J Electrochem Soc 145(9):3278–3284

    Article  Google Scholar 

  • Kern W (1990) The evolution of silicon wafer cleaning technology. J Electrochem Soc 137(6):1887–1892

    Article  Google Scholar 

  • Kim M-w, Yoon H, Ohm TY, Jo HS, An S, Choi SK et al (2017) Nanotextured cupric oxide nanofibers coated with atomic layer deposited ZnO-TiO2 as highly efficient photocathodes. Appl Catal B Environ 201:479–485

    Article  Google Scholar 

  • Kim T-G, Lee J-G, Park C-W, Jo H-S, Kim M-W, van Hest MF et al (2018) Effect of supersonic spraying impact velocity on opto-electric properties of transparent conducting flexible films consisting of silver nanowire, ITO, and polyimide multilayers. J Alloys Compd 739:653–659

    Article  Google Scholar 

  • Lee JG, Kim D-Y, Lee J-H, Kim M-w, An S, Jo HS et al (2016) Scalable binder-free supersonic cold spraying of nanotextured cupric oxide (CuO) films as efficient photocathodes. ACS Appl Mater Interfaces 8(24):15406–15414

    Article  Google Scholar 

  • Lee JG, Kim DY, Lee JH, Sinha-Ray S, Yarin AL, Swihart MT et al (2017) Production of flexible transparent conducting films of self-fused nanowires via one-step supersonic spraying. Adv Funct Mater 27(1):1602548

    Article  Google Scholar 

  • Lefebvre A (1988) Atomization and sprays. Begell House, Danbury

    Book  Google Scholar 

  • Lembach AN, Tan H-B, Roisman IV, Gambaryan-Roisman T, Zhang Y, Tropea C et al (2010) Drop impact, spreading, splashing, and penetration into electrospun nanofiber mats. Langmuir 26(12):9516–9523

    Article  Google Scholar 

  • Rayleigh L (1878) On the instability of jets. Proc Lond Math Soc s1-10(1):4–13

    Article  MathSciNet  Google Scholar 

  • Ruzyllo J, Hattori T (2014) Preface to the focus issue on semiconductor surface cleaning and conditioning. ECS J Solid State Sci Technol 3(1):Y1

    Article  Google Scholar 

  • Ruzyllo J, Hattori T, Novak RE, Mertens P, Besson P (2007) Evolution of silicon cleaning technology over the last twenty years. ECS Trans 11(2):3–7

    Article  Google Scholar 

  • Ryoo K (2005a) Characteristics of electrolyzed anode water as a display cleaning medium. Met Mater Int 11(4):295–299

    Article  MathSciNet  Google Scholar 

  • Ryoo K (2005b) Metal oxide particle removal using electrolyzed anode water. J Electrochem Soc 152(11):G885–G888

    Article  Google Scholar 

  • Ryu S, Sen P, Nam Y, Lee C (2017) Water penetration through a superhydrophobic mesh during a drop impact. Phys Rev Lett 118(1):014501

    Article  Google Scholar 

  • Sahu RP, Sinha-Ray S, Yarin A, Pourdeyhimi B (2012) Drop impacts on electrospun nanofiber membranes. Soft Matter 8(14):3957–3970

    Article  Google Scholar 

  • Sahu R, Sinha-Ray S, Yarin A, Pourdeyhimi B (2013) Blowing drops off a filament. Soft Matter 9(26):6053–6071

    Article  Google Scholar 

  • Sahu R, Sett S, Yarin A, Pourdeyhimi B (2015) Impact of aqueous suspension drops onto non-wettable porous membranes: hydrodynamic focusing and penetration of nanoparticles. Colloids Surf A Physicochem Eng Asp 467:31–45

    Article  Google Scholar 

  • Sato N, Yamazaki O, Shimogaki Y (2012) Impacts of chemical supply flow on particle removability in wet clean bath. J Electrochem Soc 159(4):H367–H372

    Article  Google Scholar 

  • Shapiro AH (1953) The dynamics and thermodynamics of compressible fluid flow, vol 1. Ronald Press, New York

    Google Scholar 

  • Xu J, Xie J, He X, Cheng Y, Liu Q (2017) Water drop impacts on a single-layer of mesh screen membrane: effect of water hammer pressure and advancing contact angles. Exp Therm Fluid Sci 82:83–93

    Article  Google Scholar 

  • Yoon H, Kim M-w, Kim H, Kim D-Y, An S, Lee J-G et al (2016) Efficient heat removal via thorny devil nanofiber, silver nanowire, and graphene nanotextured surfaces. Int J Heat Mass Transf 101:198–204

    Article  Google Scholar 

  • Zhang G, Quetzeri-Santiago MA, Stone CA, Botto L, Castrejón-Pita JR (2018) Droplet impact dynamics on textiles. Soft Matter 14(40):8182–8190

    Article  Google Scholar 

Download references

Acknowledgements

This research was supported by the Technology Development Program to Solve Climate Changes of the National Research Foundation (NRF) funded by the Ministry of Science, ICT and Future Planning (NRF-2016M1A2A2936760), NRF-2017R1A2B4005639, and NRF-2013R1A5A1073861. This research is also funded by King Saud University, Riyadh, Saudi Arabia, Researchers Supporting Project (RSP-2019/30).

Author information

Author notes

  1. Chan-Woo Park and Tae-Gun Kim have contributed equally.

Authors and Affiliations

  1. School of Mechanical Engineering, Korea University, Seoul, 24801, Republic of Korea

    Chan-Woo Park, Tae-Gun Kim, Min-Woo Kim & Sam S. Yoon

  2. Department of Chemistry, College of Science, King Saud University, Riyadh, 11451, Saudi Arabia

    Ali Aldalbahi & Mohamed El-Newehy

Authors
  1. Chan-Woo Park
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Tae-Gun Kim
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. Min-Woo Kim
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. Ali Aldalbahi
    View author publications

    You can also search for this author in PubMed Google Scholar

  5. Mohamed El-Newehy
    View author publications

    You can also search for this author in PubMed Google Scholar

  6. Sam S. Yoon
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to Sam S. Yoon.

Additional information

Publisher's Note

Springer Nature remains neutral with regard to jurisdictional claims in published maps and institutional affiliations.

Electronic supplementary material

Below is the link to the electronic supplementary material.

Supplementary file1 (WMV 65029 kb)

Rights and permissions

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Park, CW., Kim, TG., Kim, MW. et al. Splash suppression during wafer wet cleaning through drop penetration across metal meshes and porous fiber mats. J Vis 23, 269–285 (2020). https://doi.org/10.1007/s12650-019-00620-2

Download citation

  • Received:

  • Revised:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s12650-019-00620-2

Keywords

Search

Navigation