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An investigation of haptic feedback effects in telepresent microassembly

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Abstract

New manufacturing techniques are being continuously developed to facilitate producing micro parts and products. However, the assembly of these parts becomes very demanding when it comes to manual assembly, e.g. the assembly of prototypes or small batch sizes. The implementation of telepresence technology for such a task segment is a promising solution. This paper discusses the influences of haptic feedback for telepresent micro assembly. Furthermore, an experiment for haptic learning is described.

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References

  1. Bouguila L, Ishii M, Sato M (2000) A large workspace haptic device for human-scale virtual environments. In: Proceedings of the 1st haptic human–computer interaction workshop. Glasgow, Great Britain, August 2000, pp 86–91

  2. Brussel HV, Peirs J, Reynaerts D, Delchambre A, Reinhart G, Roth N, Weck M, Zussman E (2000) Assembly of microsystems. Ann CIRP 49(2):451–472

    Article  Google Scholar 

  3. Clarke S (2006) Overcoming network delays in telepresence systems with prediction and inertia. Ph.D. thesis, Technische Universität München, UTZ Verlag

  4. Cvetanovic A, Cvetanovic A, Soucek M, Andrijasevic D, Brenner W (2008) Micro assembly in a SEM chamber and the solution for collision prevention. Microsyst Technol 14(6):835–839

    Article  Google Scholar 

  5. Kim D-N, Kim K, Kim K-Y, Cha S-M (2001) Dexterous teleoperation for micro parts handling based on haptic/visual interface. International symposium on micromechatronics and human science, pp 211–217

  6. Petzold B, Kron A, Deml B (2004) How to design a haptic telepresence system for the disposal of explosive ordnances. In: Proceedings of IARP robotics and mechanical assistance in humanitarian demining and similar risky situations. Brussels, Belgium, June 2004

  7. Petzold B, Zaeh MF, Faerber B, Deml B, Egermeier H, Schilp J, Clarke S (2004) A study on visual, auditory and haptic feedback for assembly tasks. Presence Teleoper Virtual Environ 13(1):16–21

    Article  Google Scholar 

  8. Radi M, Reiter A, Zaidan S, Nitsch V, Faerber B, Reinhart G (2010) Telepresence in industrial applications: implementation issues for assembly tasks. Presence Teleoper Virtual Environ 19(5):415–429

    Google Scholar 

  9. Reinhart G, Radi M (2009) Some issues of integrating telepresence technology into industrial robotic assembly. In: Proceedings of the international conference on control and automation, Dubai, January 2009

  10. Shen Y, Xi N, Song B, Li WJ, Pomeroy CA (2006) Networked human/robot cooperative environment for tele-assembly of MEMS devices. J Micromechatron 3(3–4):239–266

    Article  Google Scholar 

  11. Shet S, Revero RD, Booty MR, Fiory AT, Lepselter MP, Ravindra NM (2006) Microassembly techniques: a review. Mater Sci Technol Assoc Iron Steel Technol 1:451–474

    Google Scholar 

  12. Steuer J (1995) Defining virtual reality: dimensions determining telepresence. In: Biocca F et al (Hrsg) Communication in the age of virtual reality. Lawrence Erlbaum, Hillsdale, pp 33–56

  13. Stoll E, Walter U, Artigas J, Preusche C, Kremer P, Hirzinger G, Letschnik J, Pongrac H (2009) Ground verification of the feasibility of telepresent on-orbit servicing. J Field Robot 26(3):287–307

    Article  Google Scholar 

  14. Van der Linde RQ, Lammertse P, Frederiksen E, Ruiter B (2002) The HapticMaster, a new high-performance haptic interface. In: Proceedings of EuroHaptics 2002. Edinburgh, UK

  15. Zaeh MF, Wiesbeck M, Stork S, Schubö A (2009) A multi-dimensional measure for determining the complexity of manual assembly operations. Prod Eng Res Dev 3(4–5):489–496

    Article  Google Scholar 

  16. Zareinejad M, Rezaei SM, Abdullah A, Ghidary SS (2009) Development of a piezo-actuated micro-teleoperation system for cell manipulation. Int J Med Robot Comput Assist Surg 5(1):66–76

    Article  Google Scholar 

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Acknowledgments

This work was supported in part by the German Research Foundation (DFG) within the Collaborative Research Center SFB 453 on “High-Fidelity Telepresence and Teleaction”.

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  1. Institute for Machine Tools and Industrial Management, Technische Universität München, Boltzmannstr. 15, 85748, Garching, Germany

    Gunther Reinhart & Andrea Reiter

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  1. Gunther Reinhart
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  2. Andrea Reiter
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Correspondence to Andrea Reiter.

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Reinhart, G., Reiter, A. An investigation of haptic feedback effects in telepresent microassembly. Prod. Eng. Res. Devel. 5, 581–586 (2011). https://doi.org/10.1007/s11740-011-0332-z

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  • DOI: https://doi.org/10.1007/s11740-011-0332-z

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