Abstract
We present an antenna-in-package system integrated with a meander line antenna based on low temperature co-fired ceramic (LTCC) technology. The proposed system employs a meander line patch antenna, a packaging layer, and a laminated multi-chip module (MCM) for integration of integrated circuit (IC) bare chips. A microstrip feed line is used to reduce the interaction between patch and package. To decrease electromagnetic coupling, a via hole structure is designed and analyzed. The meander line antenna achieved a bandwidth of 220 MHz with the center frequency at 2.4 GHz, a maximum gain of 2.2 dB, and a radiation efficiency about 90% over its operational frequency. The whole system, with a small size of 20.2 mm×6.1 mm×2.6 mm, can be easily realized by a standard LTCC process. This antenna-in-package system integrated with a meander line antenna was fabricated and the experimental results agreed with simulations well.
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Project supported by the National Natural Science Foundation of China (Nos. 61574106 and 61334003), the National Defense Pre-research Foundation of China (No. 9140A2306 0115DZ01062), and the Key Science and Technology Special Project of Shaanxi Province, China (No. 2015KTCQ01-5)
ORCID: Gang DONG, http://orcid.org/0000-0001-6557-2286
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Dong, G., Xiong, W., Wu, Zy. et al. Antenna-in-package system integrated with meander line antenna based on LTCC technology. Frontiers Inf Technol Electronic Eng 17, 67–73 (2016). https://doi.org/10.1631/FITEE.1500167
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DOI: https://doi.org/10.1631/FITEE.1500167
Keywords
- Antenna-in-package (AiP)
- Meander line antenna
- Multi-chip module (MCM)
- Low temperature co-fired ceramic (LTCC)