概要
毫米波天线设计面临高增益、宽带、低成本等诸多挑战,在该频段基片集成波导(Substrate Integrated Waveguide,SIW)由于其辐射损耗低和易集成的优势而被广泛应用。然而在毫米波频段SIW的介质损耗直接降低了天线辐射效率,若采用低损耗介质材料会导致较高的制造成本。基片集成空腔波导(Empty Substrate Integrated Waveguide,ESIW)结构通过去除SIW中介质,可实现电磁波低损耗传输,在毫米波频段具有广阔应用前景。本文面向5G n260频段应用,提出一款采用低成本FR-4 PCB板材设计的缝隙天线阵。天线采用基片集成空腔波导结构设计,消除了介质损耗,并引入高次模腔体结构,减小馈电网络复杂度,在保证天线性能前提下,实现了毫米波天线低成本制造,为低成本毫米波天线设计提供了技术参考。
天线由5层FR-4 PCB板组成,从顶层往下依次为缝隙辐射层、高次模腔体层、耦合缝隙层、功分馈电网络层以及同轴馈电层。天线底部由2.4 mm同轴馈电,通过ESIW功分馈电网络,缝隙耦合激励4×4个腔体中的TE340模式,每个TE340模式的腔体通过顶层的3×4个缝隙辐射,形成12×16的缝隙阵列。每层PCB板都将ESIW部分的介质去除并进行内壁覆铜处理,加工完成的PCB板通过周围的定位孔用螺钉组装。给出了测试S参数与仿真S参数以及测试增益与仿真增益的对比结果。S参数−8 dB带宽可覆盖n260的37–40 GHz频率范围。测试的最大实际增益为27 dBi,通过与仿真的方向性系数对比,可估计得到天线辐射效率约为72.4%。从天线在37、38、39、40 GHz处的辐射方向图看,测试的方向图与仿真结果具有很好一致性。
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Zihang QI designed the research and processed the data. Xiuping LI and Hua ZHU helped organize the manuscript. Zihang QI and Xiuping LI revised and finalized the paper.
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Zihang QI, Xiuping LI, and Hua ZHU declare that they have no conflict of interest.
Project supported by the National Key Research and Development Program of China (No. 2018YFF0212102), the National Natural Science Foundation of China (No. 61601050), and the Fundamental Research Funds for the Central Universities, China
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Qi, Z., Li, X. & Zhu, H. Low-cost high-order-mode cavity backed slot array antenna using empty substrate integrated waveguide for the 5G n260 band. Front Inform Technol Electron Eng 22, 609–614 (2021). https://doi.org/10.1631/FITEE.2000503
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DOI: https://doi.org/10.1631/FITEE.2000503