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A high-isolation coupled-fed building block for metal-rimmed 5G smartphones

一种用于5G金属边框智能手机的高隔离度耦合馈电模块

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Conclusions

A compact coupled-fed dual-antenna building block has been constructed in this study. The building block is simple in structure and easy to process, and has a high degree of isolation. The dual-antenna building block is composed of a coupled-fed loop antenna and a coupled-fed slot antenna that completely overlap. Based on this dual-antenna module, an eight-element MIMO system is designed, and the fabricated eight-element MIMO array is measured. The measured isolation of the designed eight-element MIMO system is >18.5 dB without any decoupling element. In addition, the MIMO array has good measured efficiencies, with a measured efficiency variation range of 43%–54% in the entire working frequency band. The measured ECC of the MIMO system is <0.02. Therefore, the designed MIMO array has great potential in 5G metal-rimmed mobile phone applications.

摘要

提出一款应用于第五代金属边框智能手机的高隔离度两天线模块. 基于一个蚀刻在地板上的T形缝隙, 通过合理地设计一个耦合馈电环天线和一个耦合馈电缝隙天线, 实现了一款紧凑的两天线模块. 尽管耦合馈电环天线和耦合馈电缝隙天线共口径, 两者之间的隔离度高于30 dB. 随后, 通过集成4个两天线模块, 实现了一款8×8多入多出系统. 该系统实测互耦和包络相关系数分别小于−18.5 dB和0.02.

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Data availability

The data that support the findings of this study are available from the corresponding author upon reasonable request.

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Authors and Affiliations

Authors

Contributions

Aidi REN designed the research. Aidi REN and Chengwei YU processed the data. Chengwei YU drafted the paper. Lixia YANG, Wei CUI, and Zhixiang HUANG helped organize the paper. Aidi REN and Ying LIU revised and finalized the paper.

Corresponding author

Correspondence to Aidi Ren  (任爱娣).

Ethics declarations

Aidi REN, Chengwei YU, Lixia YANG, Wei CUI, Zhixiang HUANG, and Ying LIU declare that they have no conflict of interest.

Additional information

Project supported by the National Natural Science Foundation of China (No. 62201006) and the China Postdoctoral Science Foundation (No. 2022M722961)

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Ren, A., Yu, C., Yang, L. et al. A high-isolation coupled-fed building block for metal-rimmed 5G smartphones. Front Inform Technol Electron Eng 24, 1657–1664 (2023). https://doi.org/10.1631/FITEE.2300203

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  • DOI: https://doi.org/10.1631/FITEE.2300203

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