Abstract
With the development of 3D integration technology, microsystems with vertical interconnects are attracting attention from researchers and industry applications. Basic elements of integrated passive devices (IPDs), including inductors, capacitors, and resistors, could dramatically save the footprint of the system, optimize the form factor, and improve the performance of radio frequency (RF) systems. In this paper, IPDs using thin film built-up technology are introduced, and the design and characterization of coplanar waveguides (CPWs), inductors, and capacitors are presented.
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Project (No. 2009ZX02038) supported by the National Science and Technology Major Project of China
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Sun, X., Zhu, Yh., Liu, Zh. et al. Electrical characterization of integrated passive devices using thin film technology for 3D integration. J. Zhejiang Univ. - Sci. C 14, 235–243 (2013). https://doi.org/10.1631/jzus.C12MNT01
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DOI: https://doi.org/10.1631/jzus.C12MNT01