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Reticle floorplanning of flexible chips for multi-project wafers

Published: 17 April 2005 Publication History

Abstract

Multi-project wafer has become a low-cost avenue to gain access to more advanced process technology via amortizing mask cost among chips placed on the same reticle (called reticle floorplanning). Assuming chips have flexible dimensions, we propose a non-linear programming model for reticle floorplanning to optimize reticle area and make more chips with same width or height. The model allows co-existence of chips with fixed and flexible aspect ratios and can be solved within half an hour. For the test cases originally having few chips with same width or height, our floorplanning method achieves more than 50% reduction in wafers used. We also propose an effective dicing method that saves up to 40% of wafers.

References

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M. LaPedus. Is IC industry heading to the $10 million photomask?. Semiconductor Business News, Oct. 7, 2002.
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G. Xu, R. Tian, D.F. Wong, A. J. Reich. Shuttle mask floorplanning. Proc. of SPIE. Vol. 5256, 2003, 185--194.
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M. Andersson, J. Gudmundsson, and C. Levcopoulos. Chips on wafer, or packing rectangles into grids. Computational Geometry: Theory and Applications, v 30, n 2, 2005, 95--111.
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A. B. Kahng, I. Mandoiu, Q. Wang, X. Xu, and A. Z. Zelikovsky. Multi-project reticle floorplanning and wafer dicing. Proc. of ISPD, 2004, 70--77.
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G. Xu, R. Tian, D. Z. Pan, and D. F. Wong. A multi-objective floorplanner for shuttle mask. Proc. of SPIE. Vol. 5567, 2004.
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Published In

cover image ACM Conferences
GLSVLSI '05: Proceedings of the 15th ACM Great Lakes symposium on VLSI
April 2005
518 pages
ISBN:1595930574
DOI:10.1145/1057661
  • General Chair:
  • John Lach,
  • Program Chairs:
  • Gang Qu,
  • Yehea Ismail
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Association for Computing Machinery

New York, NY, United States

Publication History

Published: 17 April 2005

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Author Tags

  1. dicing
  2. mask cost
  3. multi-project wafer
  4. reticle floorplanning

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GLSVLSI05
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GLSVLSI05: Great Lakes Symposium on VLSI 2005
April 17 - 19, 2005
Illinois, Chicago, USA

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Overall Acceptance Rate 312 of 1,156 submissions, 27%

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