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Accurate and robust geometric modeling for simulation of IC and MEMS fabrication processes

Author:

Tushar UdeshiAuthors Info & Claims

SPM '05: Proceedings of the 2005 ACM symposium on Solid and physical modeling

Pages 257 - 266

https://doi.org/10.1145/1060244.1060273

Published: 13 June 2005 Publication History

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Abstract

Simulation of IC (Integrated Circuit) and MEMS (Micro Electro Mechanical Systems) fabrication processes offers many interesting challenges. A fabrication step, such as a deposition or an etch, can result in significant changes to the surface profile of the structure. A fabrication process can consist of tens of these steps; therefore, the geometric modeling algorithm must be robust and memory and computationally efficient. Moreover, it should be flexible enough to be able to account for the varied geometric changes that can occur during a step. We describe voxel-based geometric modeling techniques (which exhibit these properties) for accurately modeling different types of deposition and etch steps.

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Cited By

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Justin Kunene TKwanda Tartibu LUkoba KJen T(2022)Review of atomic layer deposition process, application and modeling toolsMaterials Today: Proceedings10.1016/j.matpr.2022.02.09462(S95-S109)Online publication date: 2022
https://doi.org/10.1016/j.matpr.2022.02.094
Zaifa Zhou Qing-An Huang Weihua Li Chi Zhu Dawei Xu (2006)Coupled Fabrication Process Simulation and Mechanical Performance Analysis of Microstructures Based on Cellular Automata2006 5th IEEE Conference on Sensors10.1109/ICSENS.2007.355808(1061-1064)Online publication date: Oct-2006
https://doi.org/10.1109/ICSENS.2007.355808

Index Terms

Accurate and robust geometric modeling for simulation of IC and MEMS fabrication processes
1. Computing methodologies
  1. Computer graphics
    1. Graphics systems and interfaces
      1. Graphics file formats
    2. Shape modeling
      1. Parametric curve and surface models
      2. Volumetric models
2. Theory of computation
  1. Randomness, geometry and discrete structures

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Published In

SPM '05: Proceedings of the 2005 ACM symposium on Solid and physical modeling

June 2005

287 pages

ISBN:1595930159

DOI:10.1145/1060244

Program Chairs:
Leif Kobbelt
RWTH Aachen University, Germany
,
Vadim Shapiro
University of Wisconsin--Madison, USA

Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than ACM must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from [email protected]

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Published: 13 June 2005

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SPM05: 2005 ACM Symposium on Solid and Physical Modeling

June 13 - 15, 2005

Massachusetts, Cambridge

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Justin Kunene TKwanda Tartibu LUkoba KJen T(2022)Review of atomic layer deposition process, application and modeling toolsMaterials Today: Proceedings10.1016/j.matpr.2022.02.09462(S95-S109)Online publication date: 2022
https://doi.org/10.1016/j.matpr.2022.02.094
Zaifa Zhou Qing-An Huang Weihua Li Chi Zhu Dawei Xu (2006)Coupled Fabrication Process Simulation and Mechanical Performance Analysis of Microstructures Based on Cellular Automata2006 5th IEEE Conference on Sensors10.1109/ICSENS.2007.355808(1061-1064)Online publication date: Oct-2006
https://doi.org/10.1109/ICSENS.2007.355808

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Recommendations

Single mask fabrication process for movable MEMS devices

MEMS fabrication by Lithography and Reactive Ion Etching (LIRIE)

Laser Direct-Write Fabrication of MEMS

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