Article

Joint exploration of architectural and physical design spaces with thermal consideration

Authors:

Yen-Wei Wu,

Chia-Lin Yang,

Ping-Hung Yuh,

Yao-Wen ChangAuthors Info & Claims

ISLPED '05: Proceedings of the 2005 international symposium on Low power electronics and design

Pages 123 - 126

https://doi.org/10.1145/1077603.1077636

Published: 08 August 2005 Publication History

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Abstract

Heat is a main concern for processors in deep sub-micron technologies. The chip temperature is affected by both the power consumption of processor components and the chip layout. Therefore, for thermal-aware design it is crucial to consider the thermal effects of different floorplans during micro-architectural design space exploration. In this paper, we propose a thermal-aware architectural floorplanning framework. With the aid of this framework, an architect can explore both physical and architectural design spaces simultaneously to find an architecture and the corresponding chip layout that maximizes performance under a thermal limitation

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Cited By

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Jian LLiu YCheng M(2024)Predicting Accurate Hot Spots in a More Than Ten-Thousand-Core GPU with a Million-Time Speedup over FEM Enabled by a Physics-based Learning Algorithm2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)10.1109/ITherm55375.2024.10709489(1-8)Online publication date: 28-May-2024
https://doi.org/10.1109/ITherm55375.2024.10709489
Jiang LDowling ACheng MLiu Y(2023)PODTherm-GP: A Physics-Based Data-Driven Approach for Effective Architecture-Level Thermal Simulation of Multi-Core CPUsIEEE Transactions on Computers10.1109/TC.2023.327853572:10(2951-2962)Online publication date: Oct-2023
https://doi.org/10.1109/TC.2023.3278535
Jung LHaruna A(2021)Incentive-Based Scheduling for Green Computational GridRole of IoT in Green Energy Systems10.4018/978-1-7998-6709-8.ch012(272-293)Online publication date: 2021
https://doi.org/10.4018/978-1-7998-6709-8.ch012
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Joint exploration of architectural and physical design spaces with thermal consideration
1. Hardware
  1. Hardware validation

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Published In

ISLPED '05: Proceedings of the 2005 international symposium on Low power electronics and design

August 2005

400 pages

ISBN:1595931376

DOI:10.1145/1077603

General Chairs:
Kaushik Roy
Purdue University
,
Vivek Tiwari
Intel

Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than ACM must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from [email protected]

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Association for Computing Machinery

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Published: 08 August 2005

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ISLPED05: International Symposium on Low Power Electronics and Design

August 8 - 10, 2005

CA, San Diego, USA

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Overall Acceptance Rate 398 of 1,159 submissions, 34%

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Jian LLiu YCheng M(2024)Predicting Accurate Hot Spots in a More Than Ten-Thousand-Core GPU with a Million-Time Speedup over FEM Enabled by a Physics-based Learning Algorithm2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)10.1109/ITherm55375.2024.10709489(1-8)Online publication date: 28-May-2024
https://doi.org/10.1109/ITherm55375.2024.10709489
Jiang LDowling ACheng MLiu Y(2023)PODTherm-GP: A Physics-Based Data-Driven Approach for Effective Architecture-Level Thermal Simulation of Multi-Core CPUsIEEE Transactions on Computers10.1109/TC.2023.327853572:10(2951-2962)Online publication date: Oct-2023
https://doi.org/10.1109/TC.2023.3278535
Jung LHaruna A(2021)Incentive-Based Scheduling for Green Computational GridRole of IoT in Green Energy Systems10.4018/978-1-7998-6709-8.ch012(272-293)Online publication date: 2021
https://doi.org/10.4018/978-1-7998-6709-8.ch012
Haruna AJung LZakaria N(2015)Design and development of hybrid integrated thermal aware job scheduling on computational grid environment2015 International Symposium on Mathematical Sciences and Computing Research (iSMSC)10.1109/ISMSC.2015.7594020(13-17)Online publication date: May-2015
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Haruna AJung LZakaria NOkitsu J(2015)Performance comparison of thermal aware job scheduling based on multi priorities on computational grid2015 Seventh International Conference on Ubiquitous and Future Networks10.1109/ICUFN.2015.7182578(419-423)Online publication date: Jul-2015
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Sapatnekar S(2011)Overcoming Variations in Nanometer-Scale TechnologiesIEEE Journal on Emerging and Selected Topics in Circuits and Systems10.1109/JETCAS.2011.21382501:1(5-18)Online publication date: Mar-2011
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Kumar PThiele L(2011)End-to-End Delay Minimization in Thermally Constrained Distributed SystemsProceedings of the 2011 23rd Euromicro Conference on Real-Time Systems10.1109/ECRTS.2011.16(81-91)Online publication date: 5-Jul-2011
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Mesa-Martinez FArdestani ERenau JHoe JAdve V(2010)Characterizing processor thermal behaviorProceedings of the fifteenth International Conference on Architectural support for programming languages and operating systems10.1145/1736020.1736043(193-204)Online publication date: 13-Mar-2010
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Mesa-Martinez FArdestani ERenau J(2010)Characterizing processor thermal behaviorACM SIGPLAN Notices10.1145/1735971.173604345:3(193-204)Online publication date: 13-Mar-2010
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Mesa-Martinez FArdestani ERenau J(2010)Characterizing processor thermal behaviorACM SIGARCH Computer Architecture News10.1145/1735970.173604338:1(193-204)Online publication date: 13-Mar-2010
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Chiplet Placement for 2.5D IC with Sequence Pair Based Tree and Thermal Consideration

Thermal-Aware Chiplet Placement for 2.5D ICs with Sequence Pair Based Tree

A combined sensor placement and convex optimization approach for thermal management in 3D-MPSoC with liquid cooling

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