Cited By
View all- Nie CXu QWang CCao HLiu JLi Z(2023)Efficient transient thermal analysis of chiplet heterogeneous integrationApplied Thermal Engineering10.1016/j.applthermaleng.2023.120609229(120609)Online publication date: Jul-2023
- Ashok Kumar BSenthilrani SKeerthana H(2021)Thermal Aware Device Design Using Hotspot AnalysisAdvances in Automation, Signal Processing, Instrumentation, and Control10.1007/978-981-15-8221-9_245(2627-2637)Online publication date: 5-Mar-2021
- Sultan HSarangi S(2020)A Fast Leakage-Aware Green’s-Function-Based Thermal Simulator for 3-D ChipsIEEE Transactions on Very Large Scale Integration (VLSI) Systems10.1109/TVLSI.2020.302346428:11(2342-2355)Online publication date: Nov-2020
- Show More Cited By