As a powerful enabling technology, three-dimensional (3D) integration, which uses wafer bonding to integrate multiple wafers in the vertical direction and uses through‑silicon-vias (TSV) to electrically connect the wafers, have greatly ...
Micro- and integrated-optical devices in glass and polymers are integrated increasingly in microsystems. Design and simulation of such optical elements are well developed. Ray tracing and a manifold of propagation and field calculation methods are ...
This paper reports a novel method for fabricating a monolithic inkjet chip by combination of thick resist photolithography and electroforming technologies. It integrates two-step photolithography process by two kinds of thick photoresists, SU-8 and JSR, ...
Association for Computing Machinery
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