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Energy/area/delay trade-offs in the physical design of on-chip segmented bus architecture

Published: 04 March 2006 Publication History

Abstract

The increasing gap between design productivity and chip complexity, and the emerging Systems-On-Chip (SOC) architectural template have led to the wide utilization of reusable Intellectual Property (IP) cores. The physical design implementation of the macro cells (IP blocks or pre-designed blocks) in general needs to find a well balanced solution among chip area, on-chip interconnect energy and critical path delay. We are especially interested in the entire trade-off curve among these three criteria at the floorplanning stage. We show this concept for a real communication scheme based on segmented bus, rather than just an extreme solution. A fast exploration design flow from the memory organization to the final layout is introduced to explore the design space.

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  1. Energy/area/delay trade-offs in the physical design of on-chip segmented bus architecture

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    cover image ACM Conferences
    SLIP '06: Proceedings of the 2006 international workshop on System-level interconnect prediction
    March 2006
    130 pages
    ISBN:1595932550
    DOI:10.1145/1117278
    Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than ACM must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from [email protected]

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    Publication History

    Published: 04 March 2006

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    Author Tags

    1. floorplanning
    2. segmented bus
    3. trade-offs

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    View all
    • (2015)Floorplan and congestion aware framework for optimal SRAM selection for memory subsystems2015 28th IEEE International System-on-Chip Conference (SOCC)10.1109/SOCC.2015.7406922(105-110)Online publication date: Sep-2015
    • (2011)CAD tools for designing 3D integrated systems2011 IEEE International Symposium of Circuits and Systems (ISCAS)10.1109/ISCAS.2011.5938044(2229-2232)Online publication date: May-2011
    • (2010)CAPPSIEEE Transactions on Very Large Scale Integration (VLSI) Systems10.1109/TVLSI.2008.200930418:2(209-221)Online publication date: 1-Feb-2010
    • (2009)Rethinking the synthesis of buses, data mapping, and memory allocation for MPSoCDesign Automation for Embedded Systems10.1007/s10617-008-9026-y13:1-2(73-88)Online publication date: 1-Jun-2009
    • (2008)Synthesis of On-Chip Communication ArchitecturesOn-Chip Communication Architectures10.1016/B978-0-12-373892-9.00006-2(185-252)Online publication date: 2008
    • (2007)Simultaneous synthesis of buses, data mapping and memory allocation for MPSoCProceedings of the 5th IEEE/ACM international conference on Hardware/software codesign and system synthesis10.1145/1289816.1289822(3-8)Online publication date: 30-Sep-2007
    • (2007)Energy/area/delay tradeoffs in the physical design of on-chip segmented bus architectureIEEE Transactions on Very Large Scale Integration (VLSI) Systems10.1109/TVLSI.2007.90075815:8(941-944)Online publication date: 1-Aug-2007
    • (2006)System-level power-performance trade-offs in bus matrix communication architecture synthesisProceedings of the 4th international conference on Hardware/software codesign and system synthesis10.1145/1176254.1176327(300-305)Online publication date: 22-Oct-2006

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