skip to main content
10.1145/1146909.1147052acmconferencesArticle/Chapter ViewAbstractPublication PagesdacConference Proceedingsconference-collections
Article

HybDTM: a coordinated hardware-software approach for dynamic thermal management

Published: 24 July 2006 Publication History

Abstract

With ever-increasing power density and cooling costs in modern high-performance systems, dynamic thermal management (DTM) has emerged as an effective technique for guaranteeing thermal safety at run-time. While past works on DTM have focused on different techniques in isolation, they fail to consider a synergistic mechanism using both hardware and software support and hence lead to a significant execution time overhead.In this paper, we propose HybDTM, a methodology for fine-grained, coordinated thermal management using a hybrid of hardware techniques, such as clock gating, and software techniques, such as thermal-aware process scheduling, synergistically leveraging the advantages of both approaches. We show that while hardware techniques can be used reactively to manage thermal emergencies, proactive use of low-overhead software techniques can rely on application-specific thermal profiles to lower system temperature. Our technique involves a novel regression-based thermal model which provides fast and accurate temperature estimates for run-time thermal characterization of applications running on the system, using hardware performance counters, while considering system-level thermal issues. We evaluate HybDTM on an actual desktop system running a number of SPEC2000 benchmarks, in both uniprocessor and simultaneous multi-threading (SMT) environments, and show that it is able to successfully manage the overall temperature with an average execution time overhead of only 9.9% (16.3% maximum) compared to the case without any DTM, as opposed to 20.4% (29.5% maximum) overhead for purely hardware-based DTM.

References

[1]
IA-32 Intel architecture software developer's manual, Vol. 3: System programming guide. http://developer.intel.com/design/pentium4/manuals/245472.htm
[2]
Intel Pentium 4 processor in the 478-pin package thermal design guidelines. http://developer.intel.com/design/pentium4/guides/249889.htm.
[3]
Mobile Intel Pentium 4 processor--M datasaheet. http://www.intel.com.
[4]
J. Baek et al., "Thermal characterization of high speed DDR devices in system environments," in Proc. Ninth Annual IEEE Semiconductor Thermal Measurement and Management Symp., Mar. 2003.
[5]
F. Bellosa et al., "Event-driven energy accounting for dynamic thermal management," in Proc. Wkshp. Compilers and Operating Systems for Low Power, Sept. 2003.
[6]
D. Brooks et al., "Dynamic thermal management for high-performance microprocessors," in Proc. Int. Symp. High Performance Computer Architecture, Jan. 2001, pp. 171--182.
[7]
X. Fan et al., "Memory controller policies for DRAM power management," in Proc. IEEE Symp. Low Power Electronics, Aug. 2001.
[8]
G. Hilton et al., "The microarchitecture of the Pentium 4 processor," Intel Technology Journal, Feb. 2001.
[9]
M. Huang et al., "A framework for dynamic energy efficiency and temperature management," in Proc. Int. Symp. Microarchitecture, Dec. 2000, pp. 202--213.
[10]
C. Isci et al., "Run-time power monitoring in high-end processors: Methodology and empirical data," in Proc. Int. Symp. Microarchitecture, Dec. 2003.
[11]
J. Janzen, "Calculating memory system power for DDR SDRAM," Designline, vol. 10, no. 2, 2001.
[12]
D. Koufaty et al., "Hyperthreading technology in the netburst microarchitecture," IEEE Micro, vol. 23, no. 2, pp. 56--65, Mar. 2003.
[13]
K.-J. Lee et al., "Using performance counters for runtime temperature sensing in high-performance processors," in Proc. Wkshp. High-Performance Power-Aware Computing, Apr. 2005.
[14]
L. Shang, L.-S. Peh, A. Kumar and N. K. Jha, "Thermal modeling, characterization and management of on-chip networks," in Proc. Int. Symp. Microarchitecture, Dec. 2004.
[15]
K. Skadron, "Hybrid architectural dynamic thermal management," in Proc. Design Automation and Test in Europe Conf., Feb. 2004, pp. 10--15.
[16]
K. Skadron et al., "Temperature-aware microarchitecture," in Proc. Int. Symp. Computer Architecture, June 2003, pp. 1--12.
[17]
B. Sprunt, "Pentium 4 performance-monitoring features," IEEE Micro, vol. 22, no. 4, pp. 72--82, Jul./Aug. 2002.
[18]
A. Weissel et al., "Dynamic thermal management for distributed systems," in Proc. Wkshp. Temperature-Aware Computer Systems, June 2004.

Cited By

View all
  • (2023)Firmware-based approach for efficient Power Management in Mobile Platforms2023 2nd International Conference for Innovation in Technology (INOCON)10.1109/INOCON57975.2023.10101057(1-6)Online publication date: 3-Mar-2023
  • (2022)Temperature Estimation in Multi-Core Processors Using Statistical Approach for Task SchedulingCommunication and Intelligent Systems10.1007/978-981-19-2130-8_75(963-972)Online publication date: 19-Aug-2022
  • (2021)A Survey of Thermal Management in Cloud Data Centre: Techniques and Open IssuesWireless Personal Communications10.1007/s11277-020-08039-xOnline publication date: 15-Jan-2021
  • Show More Cited By

Index Terms

  1. HybDTM: a coordinated hardware-software approach for dynamic thermal management

    Recommendations

    Comments

    Information & Contributors

    Information

    Published In

    cover image ACM Conferences
    DAC '06: Proceedings of the 43rd annual Design Automation Conference
    July 2006
    1166 pages
    ISBN:1595933816
    DOI:10.1145/1146909
    Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than ACM must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from [email protected]

    Sponsors

    Publisher

    Association for Computing Machinery

    New York, NY, United States

    Publication History

    Published: 24 July 2006

    Permissions

    Request permissions for this article.

    Check for updates

    Author Tags

    1. dynamic thermal management
    2. hybrid hardware-software management
    3. thermal model

    Qualifiers

    • Article

    Conference

    DAC06
    Sponsor:
    DAC06: The 43rd Annual Design Automation Conference 2006
    July 24 - 28, 2006
    CA, San Francisco, USA

    Acceptance Rates

    Overall Acceptance Rate 1,770 of 5,499 submissions, 32%

    Upcoming Conference

    DAC '25
    62nd ACM/IEEE Design Automation Conference
    June 22 - 26, 2025
    San Francisco , CA , USA

    Contributors

    Other Metrics

    Bibliometrics & Citations

    Bibliometrics

    Article Metrics

    • Downloads (Last 12 months)9
    • Downloads (Last 6 weeks)1
    Reflects downloads up to 16 Feb 2025

    Other Metrics

    Citations

    Cited By

    View all
    • (2023)Firmware-based approach for efficient Power Management in Mobile Platforms2023 2nd International Conference for Innovation in Technology (INOCON)10.1109/INOCON57975.2023.10101057(1-6)Online publication date: 3-Mar-2023
    • (2022)Temperature Estimation in Multi-Core Processors Using Statistical Approach for Task SchedulingCommunication and Intelligent Systems10.1007/978-981-19-2130-8_75(963-972)Online publication date: 19-Aug-2022
    • (2021)A Survey of Thermal Management in Cloud Data Centre: Techniques and Open IssuesWireless Personal Communications10.1007/s11277-020-08039-xOnline publication date: 15-Jan-2021
    • (2020)A Survey on Energy Management for Mobile and IoT DevicesIEEE Design & Test10.1109/MDAT.2020.297666937:5(7-24)Online publication date: Oct-2020
    • (2019)Affinity-Driven Modeling and Scheduling for Makespan Optimization in Heterogeneous Multiprocessor SystemsIEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems10.1109/TCAD.2018.284665038:7(1189-1202)Online publication date: Jul-2019
    • (2018)Makespan Minimization for Multiprocessor Real-Time Systems under Thermal and Timing ConstraintsJournal of Circuits, Systems and Computers10.1142/S0218126619501457(1950145)Online publication date: 7-Sep-2018
    • (2018)Novel Feature Selection Algorithm for Thermal Prediction ModelIEEE Transactions on Very Large Scale Integration (VLSI) Systems10.1109/TVLSI.2018.284131826:10(1831-1844)Online publication date: Oct-2018
    • (2018)Machine Learning-Based Temperature Prediction for Runtime Thermal Management Across System ComponentsIEEE Transactions on Parallel and Distributed Systems10.1109/TPDS.2017.273295129:2(405-419)Online publication date: 1-Feb-2018
    • (2018)LIBRA: Thermal and Process Variation Aware Reliability Management in Photonic Networks-on-ChipIEEE Transactions on Multi-Scale Computing Systems10.1109/TMSCS.2018.28462744:4(758-772)Online publication date: 1-Oct-2018
    • (2018)TheSPoT: Thermal Stress-Aware Power and Temperature Management for Multiprocessor Systems-on-ChipIEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems10.1109/TCAD.2017.276841737:8(1532-1545)Online publication date: Aug-2018
    • Show More Cited By

    View Options

    Login options

    View options

    PDF

    View or Download as a PDF file.

    PDF

    eReader

    View online with eReader.

    eReader

    Figures

    Tables

    Media

    Share

    Share

    Share this Publication link

    Share on social media