The unified wire adapter
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Mixed wire and surface-wave communication fabrics for decentralized on-chip multicasting
DATE '15: Proceedings of the 2015 Design, Automation & Test in Europe Conference & ExhibitionNetwork-on-chip (NoC) has emerged to tackle different on-chip challenges and has satisfied different demands in terms of high performance, economical and reliable interconnect implementation. However, a merely metal-based interconnect reaches ...
Leveraging Wire Properties at the Microarchitecture Level
In future microprocessors, communication will emerge as the major bottleneck. The authors advocate composing future interconnects of some wires that minimize latency, some that maximize bandwidth, and some that minimize power. A microarchitecture aware ...
A study of a wire-wireless hybrid NoC architecture with an energy-proportional multicast scheme for energy efficiency
The efficiency of interconnect network-on-chip (NoC) design significantly affects the thermal and energy-consumption problems. The wireless interconnect NoC (WiNoC) design provides a promising NoC architecture for multicast in chip multiprocessor (CMP) ...
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New York, NY, United States
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