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Adaptive multi-domain thermal modeling and analysis for integrated circuit synthesis and design

Published: 05 November 2006 Publication History

Abstract

Chip-package thermal analysis is necessary for the design and synthesis of reliable, high-performance, low-power, compact integrated circuits (ICs). Many methods of IC thermal analysis suffer performance or accuracy problems that prevent use in IC synthesis and hinder use in architectural design.
This article describes ISAC, a novel, fast, accurate thermal analysis system for use in IC synthesis and design. We present new, cooperative, temporal and spatial adaptation methods to dramatically accelerate accurate analysis. The proposed system unifies steady-state, time-domain, and frequency-domain analysis techniques. It is composed of our spatially-adaptive multigrid iterative solver, a new temporally and spatially adaptive asynchronous time marching solver, and a new spatially-adaptive frequency-domain moment matching solver. Together, these cooperative adaptation and multi-domain analysis techniques allow the proposed system to efficiently solve the static, short time scale, and long time scale variants of the IC thermal analysis problem.
Experimental results demonstrate significant performance improvement over existing thermal analysis solutions. Our spatial adaptation techniques bring a 21.6x -690.0x speedup over recently-published steady-state thermal analysis techniques. Our unified spatial and temporal adaptation techniques, within our asynchronous time marching method, bring a 1,071x -1,890x speedup over other widely-used, time-domain thermal analysis techniques with less than 0.5% error. Our spatial adaptation techniques enable the efficient use of our frequency-domain thermal analysis technique, which brings a 10x -100x speedup over the fastest-known time-domain technique, when used for long time scale thermal analysis. The thermal analysis system described in this article has been implemented as a C/C++ library that has been publicly released for free academic and personal use.

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cover image ACM Conferences
ICCAD '06: Proceedings of the 2006 IEEE/ACM international conference on Computer-aided design
November 2006
147 pages
ISBN:1595933891
DOI:10.1145/1233501
Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than ACM must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from [email protected]

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Published: 05 November 2006

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  • (2017)Computationally efficient standard-cell FEM-based thermal analysisProceedings of the 36th International Conference on Computer-Aided Design10.5555/3199700.3199765(490-495)Online publication date: 13-Nov-2017
  • (2017)A Zonal Different-Time-Step Algorithm for Multi-Physics Simulation in Closed SystemJournal of Signal Processing Systems10.1007/s11265-016-1122-986:2-3(279-288)Online publication date: 1-Mar-2017
  • (2016)Thermal and power aware task mapping on 3D Network on ChipComputers and Electrical Engineering10.1016/j.compeleceng.2015.12.00151:C(157-167)Online publication date: 1-Apr-2016
  • (2014)A Secure Algorithm for Task Scheduling against Side-channel AttacksProceedings of the 4th International Workshop on Trustworthy Embedded Devices10.1145/2666141.2666142(3-12)Online publication date: 3-Nov-2014
  • (2014)Statistical Framework for Designing On-Chip Thermal Sensing Infrastructure in Nanoscale SystemsIEEE Transactions on Very Large Scale Integration (VLSI) Systems10.1109/TVLSI.2013.224492622:2(270-279)Online publication date: 1-Feb-2014
  • (2013)Fast Thermal Analysis on GPU for 3D ICs With Integrated Microchannel CoolingIEEE Transactions on Very Large Scale Integration (VLSI) Systems10.1109/TVLSI.2012.221105021:8(1526-1539)Online publication date: 1-Aug-2013
  • (2012)A Transient Electrothermal Analysis of Three-Dimensional Integrated CircuitsIEEE Transactions on Components, Packaging and Manufacturing Technology10.1109/TCPMT.2011.21784142:4(660-667)Online publication date: Apr-2012
  • (2011)Full-Spectrum Spatial–Temporal Dynamic Thermal Analysis for Nanometer-Scale Integrated CircuitsIEEE Transactions on Very Large Scale Integration (VLSI) Systems10.1109/TVLSI.2010.207635119:12(2276-2289)Online publication date: 1-Dec-2011
  • (2011)Runtime Power Management of 3-D Multi-Core Architectures Under Peak Power and Temperature ConstraintsIEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems10.1109/TCAD.2010.210137130:6(905-918)Online publication date: 1-Jun-2011
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