Ruchir Puri
ABSTRACT
Thermal issues are becoming more important but is the hype getting the better of the facts? Does this deserve more attention than for some niche designs and technologies such as 3D ICs.? Does the broader design community need to worry about it at 32nm and beyond or it will only impact a small segment of designs? In short, does the severity of power issues coupled with packaging complexity translate into a thermal crisis in future? This is an educational panel with a little bit of controversy that will address the thermal issue in IC design. When will this issue be emerging as a crucial concern if at all? What are the solutions to resolve this potential crisis?
Index Terms
- Keeping hot chips cool: are IC thermal problems hot air?
Recommendations
Keeping hot chips cool
DAC '05: Proceedings of the 42nd annual Design Automation ConferenceWith 90nm CMOS in production and 65nm testing in progress, power has been pushed to the forefront of design metrics. This paper will outline practical techniques that are used to reduce both leakage as well as active power in a standard-cell library ...
Influence of base resistance on extracting thermal resistance for SiGe HBTs
In this article, the influence of base resistance on extracting thermal resistance for SiGe heterojunction bipolar transistors is studied and an improved approach for determining the junction temperature and thermal resistance is presented. The proposed ...
Cooling mechanisms in 3D ICs: Thermo-mechanical perspective
IGCC '11: Proceedings of the 2011 International Green Computing Conference and WorkshopsThree-dimensional (3D) integrated circuits (IC) impose several challenges in thermal management. Stacking vertical layers significantly increases the heat dissipation per unit volume and the thermal footprint per unit area. The internal layers in the ...
Comments