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Accurate and analytical statistical spatial correlation modeling for VLSI DFM applications

Published: 08 June 2008 Publication History

Abstract

With the significant advancement of statistical timing and yield analysis algorithms, there is a strong need for accurate and analytical spatial correlation models. In this paper, we propose a novel spatial correlation modeling method not only can capture the general spatial correlation relationship but also can generate highly accurate and analytical models. Our method, based on Singular Value Decomposition (SVD), can generate sequences of polynomial weighted by the singular values. Experimental results from foundry measurement data show that our proposed approach is 5X accuracy improvement over several distance based spatial correlation modeling methods.

References

[1]
H. Chang and S. S. Sapatnekar. Statistical timing analysis considering spatial correlations using a single pert-like traversal. ICCAD, Nov 2003. pp. 621--625.
[2]
Kaviraj Chorpa, Narendra Shenoy, and David Blaauw. Variogrm based robust extraction of process variation. TAU, 2007.
[3]
J. Le, X. Li, and L. Pileggi. Stac: statistical timing analyis with correlation. Design Automation Coference, June 2004. pp. 343--348.
[4]
Frank Liu. How to construct spatial correlation models: A mathmatical approach. Tau, 2007.
[5]
S. R. Nassif. Modeling and analysis of manufacturing variations. CICC, 2001. pp. 223--228.
[6]
Sanghamitra Roy, Weijen Chen, and Charlie Chung Ping Chen. Convexfit: An optimal minimum-error convex fitting and smoothing algorithm with application to gate-sizing. ICCAD, 2005.
[7]
C. Visweswariah, K. Ravindran, and K. Kalafala. First-order parameterized block-based statistical timing analysis. Tau, Feb 2004.
[8]
Jinjun Xiong, Vladimir Zolotov, and Lei He. Robust extraction of spatial correlation. ISPD, 2006.

Cited By

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  • (2014)SRAM Array Yield Estimation under Spatially-Correlated Process VariationProceedings of the 2014 IEEE 23rd Asian Test Symposium10.1109/ATS.2014.43(149-155)Online publication date: 16-Nov-2014
  • (2013)Design and Analysis of a Robust Carbon Nanotube-Based Asynchronous Primitive CircuitACM Journal on Emerging Technologies in Computing Systems10.1145/2422094.24220989:1(1-27)Online publication date: 1-Feb-2013
  • (2011)Hybrid modeling of non-stationary process variationsProceedings of the 48th Design Automation Conference10.1145/2024724.2024768(194-199)Online publication date: 5-Jun-2011
  • Show More Cited By

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  1. Accurate and analytical statistical spatial correlation modeling for VLSI DFM applications

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    cover image ACM Conferences
    DAC '08: Proceedings of the 45th annual Design Automation Conference
    June 2008
    993 pages
    ISBN:9781605581156
    DOI:10.1145/1391469
    • General Chair:
    • Limor Fix
    Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than ACM must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from [email protected]

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    Publication History

    Published: 08 June 2008

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    Author Tags

    1. SSTA
    2. process variation
    3. spatial correlation

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    Overall Acceptance Rate 1,770 of 5,499 submissions, 32%

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    Cited By

    View all
    • (2014)SRAM Array Yield Estimation under Spatially-Correlated Process VariationProceedings of the 2014 IEEE 23rd Asian Test Symposium10.1109/ATS.2014.43(149-155)Online publication date: 16-Nov-2014
    • (2013)Design and Analysis of a Robust Carbon Nanotube-Based Asynchronous Primitive CircuitACM Journal on Emerging Technologies in Computing Systems10.1145/2422094.24220989:1(1-27)Online publication date: 1-Feb-2013
    • (2011)Hybrid modeling of non-stationary process variationsProceedings of the 48th Design Automation Conference10.1145/2024724.2024768(194-199)Online publication date: 5-Jun-2011
    • (2010)On confidence in characterization and application of variation modelsProceedings of the 2010 Asia and South Pacific Design Automation Conference10.5555/1899721.1899894(751-756)Online publication date: 18-Jan-2010
    • (2010)Accurate and analytical statistical spatial correlation modeling based on singular value decomposition for VLSI DFM applicationsIEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems10.1109/TCAD.2010.204289029:4(580-589)Online publication date: 1-Apr-2010
    • (2010)Spatial correlation extraction with a limited amount of measurement data2nd Asia Symposium on Quality Electronic Design (ASQED)10.1109/ASQED.2010.5548251(248-254)Online publication date: Aug-2010
    • (2010)On confidence in characterization and application of variation models2010 15th Asia and South Pacific Design Automation Conference (ASP-DAC)10.1109/ASPDAC.2010.5419790(751-756)Online publication date: Jan-2010
    • (2009)Physically justifiable die-level modeling of spatial variation in view of systematic across wafer variabilityProceedings of the 46th Annual Design Automation Conference10.1145/1629911.1629945(104-109)Online publication date: 26-Jul-2009

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