research-article

Free access

On microelectronic components, interconnections, and system fabrication

Author:

Kenneth R. ShouldersAuthors Info & Claims

IRE-AIEE-ACM '60 (Western): Papers presented at the May 3-5, 1960, western joint IRE-AIEE-ACM computer conference

Pages 251 - 258

https://doi.org/10.1145/1460361.1460396

Published: 03 May 1960 Publication History

Abstract

Microelectronic data processing systems are analyzed and various requirements for components are considered. The rapid reduction in transmission line cross section upon scaling down causes increased losses in microelectronic systems thus giving rise to the need for high impedance components for non-cryogenic applications. A new component is proposed that seems particularly suited for microelectronic system requirements and fabrication methods. This component is based upon the quantum mechanical tunneling of electrons into vacuum; has an estimated switching time of 10^-10 seconds; promises immunity to temperature variations; and seems adaptable to self-forming manufacturing methods giving component uniformity. A method of electron beam activitated micromachining for film materials is presented in which a thin chemically resistant film is formed with an electron beam to selectively protect the film being machined during a subsequent molecular beam etching. This high speed process has resolution capabilities of several hundred angstrom units; can process electronically clean materials with minimum contamination; and may ultimately be suited for the economical production of one cubic inch data processing systems having 10¹¹ active components.

References

[1]

L. Holland, Vacuum Deposition of Thin Films, p. 233 (John Wiley & Sons, Inc., New York, N.Y. 1956). See section on "Conduction in Very Thin Films" and section on "Mean Free Path of Conduction Electrons."

[2]

D. A. Powers and A. Von Hippel, Massachusetts Institute of Technology, Laboratory for Insulation Research. Progress Reports show consistent breakdown strengths between 50 and 200 megavolts per centimeter for film thicknesses between 700 and 4000 angstroms using alumino silicate glass.

[3]

W. P. Dyke and W. W. Dolan, Advances in Electronics and Electron Physics, Vol. VIII, p. 153 (Academic Press, Inc., New York, N.Y., 1956). See the discussion on field emission cathode blunting.

[4]

E. Mueller, Handbuch der Physik, Vol. 21, p. 202. Springer-Verlag, Berlin (1956).

[5]

V. E. Cosslett, A. Engstrom, and H. H. Pattee, X-Ray Microscopy and Microradiography, p. 336 (Academic Press, Inc., New York, N.Y., 1957).

[6]

W. P. Dyke and W. W. Dolan, Advances in Electronics and Electron Physics, Vol. VIII, p. 109 (Academic Press, Inc., New York, N.Y., 1956).

[7]

J. P. Barbour, F. M. Charbonnier, L. F. Garrett, W. P. Dyke, "On the Application of Field Emission to a Two Cavity Microwave Amplifier." Paper given at the 1958 Field Emission Symposium, University of Chicago.

[8]

Russell D. Young, Erwin W. Mueller, "Experimental Determination of the Total Energy Distribution of Field Emitted Electrons." Paper given at 1958 Field Emission Symposium, University of Chicago.

[9]

W. P. Dyke and W. W. Dolan, Advances in Electronics and Electron Physics, Vol. VIII, p. 120, 121, Appendix II (Academic Press, Inc., New York, N.Y., 1956).

[10]

E. E. Martin, J. K. Trolan, and B. W. Steller, "Research on Field Emission Cathodes," Scientific Report 5, Contract AF 33(616)-5404, Linfield Research Institute, McMinnville, Oregon (1959).

[11]

H. Bruining, Physics and Application of Secondary Electron Emission, McGraw-Hill, New York, N.Y. (1954).

[12]

A. M. Skellett, "The Use of Secondary Electron Emission to Obtain Trigger or Relay Action," J. Appl. Phys., Vol. 13, p. 519 (August 1942).

[13]

J. S. Cook, R. Kompfner, W. H. Yocom, "Slalom Focusing," Proc. of the Inst. of Radio Engineers, Vol. 45, p. 1517 (1957).

[14]

C. Burton Crumly and Robert Adler, "Electron Beam Parametric Amplifiers," p. 73, Electronic Industries (November 1959).

[15]

C. F. Powell, I. E. Campbell, and B. W. Gonser, Vapor-Plating, John Wiley & Sons, Inc., New York, N.Y. (1955).

[16]

D. A. Buck and K. R. Shoulders, "An Approach to Microminiature Printed Systems," proceedings of the Eastern Joint Computer Conference (December 1958) special publication T-114.

Digital Library

[17]

V. E. Cosslett, A. Engstrom, H. H. Pattee, X-Ray Microscopy and Microradiography, Academic Press, Inc., New York, N.Y. (1957).

[18]

V. E. Cosslett and P. Duncumb, "A Scanning Microscope with Either Electron or X-Ray Recording," p. 12, Academic Press, Inc., New York, N.Y., Electron Microscopy--Proceedings of the Stockholm Conference (September 1956).

[19]

H. E. Farnsworth, R. E. Schilier, T. H. George, and R. M. Burger, "Application of the Ion Bombardment Cleaning Method to Titanium, Germanium, Silicon, and Nickel as Determined by Low-Energy Electron Diffraction," J. Appl. Phys., Vol. 29, p. 1150 (1958).

[20]

Ludwig Mayer, J. Appl. Phys., Vol. 26, p. 1228 (1955); Vol. 28, p. 975 (1957); Vol. 29, p. 658 (1958); Vol. 29, p. 1454 (1958).

Cited By

Schneiker CHameroff SVoelker MHe JDereniak EMcCuskey R(2011)Scanning tunnelling engineeringJournal of Microscopy10.1111/j.1365-2818.1988.tb01424.x152:2(585-596)Online publication date: 2-Aug-2011
https://doi.org/10.1111/j.1365-2818.1988.tb01424.x
Cheng GLedley ROuyang B(1970)Pattern Recognition with Time Interval Modulation Information CodingIEEE Transactions on Aerospace and Electronic Systems10.1109/TAES.1970.310104AES-6:2(221-227)Online publication date: Mar-1970
https://doi.org/10.1109/TAES.1970.310104
Crane H(1962)Neuristor-A Novel Device and System ConceptProceedings of the IRE10.1109/JRPROC.1962.28823450:10(2048-2060)Online publication date: Oct-1962
https://doi.org/10.1109/JRPROC.1962.288234
Show More Cited By

Recommendations

Laser moulding, a new low-cost fabrication process for micro- and nanostructured components

Laser moulding is a new polymer moulding process developed and enhanced for the fabrication of micro- and nanostructured components at the Karlsruhe Institute of Technology. This report describes the potential offering by laser moulding. Besides known ...
Micro fabrication of stainless steel micro components using soft moulding and aqueous slurry

Presented is a fabrication process of stainless steel micro components. The fabrication process is divided into two main parts. In the first part, high quality SU-8 master moulds and their negative replicas from soft moulds are produced using ...
Fabrication of vertical nanopillar devices

Electron transport in silicon nanopillars has been investigated, with a view to developing vertical electron emission, electroluminescent and photoluminescent devices. Arrays of nanopillars were fabricated in highly-doped single crystal silicon and ...

Comments

Information & Contributors

Information

Published In

cover image ACM Conferences

IRE-AIEE-ACM '60 (Western): Papers presented at the May 3-5, 1960, western joint IRE-AIEE-ACM computer conference

May 1960

391 pages

ISBN:9781450378697

DOI:10.1145/1460361

Conference Chair:
R. M. Bennett
IBM Corp., San Jose, California

Copyright © 1960 ACM.

Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than ACM must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from [email protected]

Sponsors

American Institute of Electrical Engineers
The Institute of Radio Engineers
ACM: Association for Computing Machinery

Publisher

Association for Computing Machinery

New York, NY, United States

Publication History

Published: 03 May 1960

Permissions

Request permissions for this article.

Request Permissions

Check for updates

Qualifiers

Research-article

Contributors

Other Metrics

View Article Metrics

Bibliometrics & Citations

Bibliometrics

Article Metrics

4
Total Citations
View Citations
160
Total Downloads

Downloads (Last 12 months)27
Downloads (Last 6 weeks)5

Reflects downloads up to 01 Mar 2025

Other Metrics

View Author Metrics

Citations

Cited By

Schneiker CHameroff SVoelker MHe JDereniak EMcCuskey R(2011)Scanning tunnelling engineeringJournal of Microscopy10.1111/j.1365-2818.1988.tb01424.x152:2(585-596)Online publication date: 2-Aug-2011
https://doi.org/10.1111/j.1365-2818.1988.tb01424.x
Cheng GLedley ROuyang B(1970)Pattern Recognition with Time Interval Modulation Information CodingIEEE Transactions on Aerospace and Electronic Systems10.1109/TAES.1970.310104AES-6:2(221-227)Online publication date: Mar-1970
https://doi.org/10.1109/TAES.1970.310104
Crane H(1962)Neuristor-A Novel Device and System ConceptProceedings of the IRE10.1109/JRPROC.1962.28823450:10(2048-2060)Online publication date: Oct-1962
https://doi.org/10.1109/JRPROC.1962.288234
Widrow BPierce WAngell J(1961)Birth, Life, and Death in Microelectronic SystemsIRE Transactions on Military Electronics10.1109/IRET-MIL.1961.5008348MIL-5:3(191-201)Online publication date: Jul-1961
https://doi.org/10.1109/IRET-MIL.1961.5008348

View Options

View options

PDF

View or Download as a PDF file.

eReader

View online with eReader.

Login options

Check if you have access through your login credentials or your institution to get full access on this article.

Full Access

Get this Publication

Figures

Tables

Media

View Table of Conten