Technical perspective
Where the chips may fall

Three-dimensional stacking of silicon layers is emerging as a promising solution to handle the design complexity and heterogeneity of Systems on Chips (SoCs). Networks on Chips (NoCs) are necessary to efficiently handle the 3D interconnect complexity. ...

The next generation of multiprocessor system on chip (MPSoC) and chip multiprocessors (CMPs) will contain hundreds or thousands of cores. Such a many-core system requires high-performance interconnections to transfer data among the cores on the chip. ...

Phenomenological assumptions---assumptions about the fundamental qualities of the phenomenon being studied and how it relates to the environment in which it occurs---affect the dissemination of knowledge from subfields to the broader field of study. ...