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Hybrid logical-statistical simulation with thermal and IR-drop mapping for degradation and variation prediction

Published: 19 August 2009 Publication History

Abstract

We present a statistical life-time description for digital systems, which is characterised by short term functional simulation. Temperature and IR-drops for each hardware task of the system are regarded based on a coarse RT floorplan and a component wise prediction of the dynamic and leakage power. By iteratively updating threshold voltage and supply resistances, then dynamic and leakage power, then temperature and IR-drop distribution, electro-thermal coupling as well as long term degradation effects can be described.

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  • (2018)Leakage Models for High-Level Power EstimationIEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems10.1109/TCAD.2017.276051937:8(1627-1639)Online publication date: Aug-2018

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  1. Hybrid logical-statistical simulation with thermal and IR-drop mapping for degradation and variation prediction

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    cover image ACM Conferences
    ISLPED '09: Proceedings of the 2009 ACM/IEEE international symposium on Low power electronics and design
    August 2009
    452 pages
    ISBN:9781605586847
    DOI:10.1145/1594233
    Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than ACM must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from [email protected]

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    Published: 19 August 2009

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    Author Tags

    1. IR-drop
    2. electro-thermal coupling
    3. reliability
    4. system level estimation
    5. thermal modelling

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    ISLPED '09 Paper Acceptance Rate 72 of 208 submissions, 35%;
    Overall Acceptance Rate 398 of 1,159 submissions, 34%

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    • (2018)Leakage Models for High-Level Power EstimationIEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems10.1109/TCAD.2017.276051937:8(1627-1639)Online publication date: Aug-2018

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