Yaoguang Wei
Sachin S. Sapatnekar
ABSTRACT
This paper presents a router that minimizes the amount of dummy fill necessary to satisfy the requirements for chemical-mechanical polishing (CMP). The algorithm uses a greedy strategy and effective cost functions to control the maximal effective pattern density during routing. On a standard set of benchmark circuits, our CMP-aware router can reduce the required dummy fill by 22.0% on average, and up to 41.5%, as compared to the CMP-unaware case. In comparison with another CMP-aware routing approach, our algorithm is demonstrated to reduce the amount of dummy fill by 14.1% on average, and up to 23.6%, over the benchmarks.
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Index Terms
- Dummy fill optimization for enhanced manufacturability
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