Eli Chiprout
ABSTRACT
Power grids with die-scale dimensions operate in a transient manner that is difficult to predict compared to larger power grids. Given a single excitation and a detailed model one can come to understand the dynamic effects occurring inside the die in terms of localized voltage droop scenarios. However, a major portion of understanding on-die power grids has to do with modeling the current stimulus pre-silicon for design purposes as well as generating a set of activities (via instructions) post-silicon in order to excite the worst case voltage droop. Any chip, especially a microprocessor, contains so many potential state transitions that it is not possible to simulate or enumerate all of them. A spectral-based learning and optimization method can alleviate this problem pre-silicon, while a micro-architectural based test generation scheme can help alleviate the problem post silicon.
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Digital Library
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- Chiprout E, "Fast flip-chip power grid analysis via locality and grid shells", IEEE/ACM ICCAD, 2004, pp. 485--488. Google ScholarDigital Library
- Qian H., Nassif S. R., Sapatnekar S. S., "Power Grid Analysis using Random Walks", IEEE Trans. on CAD, Volume 24, Issue 8, Aug. 2005, pp. 1204--1224. Google ScholarDigital Library
- Pant, S. and Chiprout, E., "Power grid physics and implications for CAD", Proceedings of the 43rd ACM/IEEE Design Automation Conference, 2006. Google ScholarDigital Library
- Bastani, P., Killpack, K., Wang, L.-C. and Chiprout, E., "Speedpath prediction based on learning from a small set of examples", Proceedings of the 45th ACM/IEEE Design Automation Conference, 2008. Google ScholarDigital Library
- Ketkar M. and Chiprout E., "A microarchitecture-based framework for pre- and post-silicon power delivery analysis", IEEE/ACM International Symposium on Microarchitecture, Dec. 2009. Google ScholarDigital Library
- Ferzli, I. A., Chiprout, E. and Najm, F. N., "Verification and Codesign of the Package and Die Power Delivery System Using Wavelets", IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, Volume: 29, 2010, Pages: 92--102. Google ScholarDigital Library
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Index Terms
- On-die power grids: the missing link
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