Claudius Feger
ABSTRACT
The tutorial addresses challenges in systems packaging for next generation devices, reviewing the technology paths currently being developed to address issues on two- and three-dimensional packaging, high performance interfaces and materials issues related to advanced packaging. The emphasis will be on manufacturing solutions that promise to provide increasing levels of system performance required to gain the benefits of device integration for 22nm and below.
Index Terms
- Packaging issues for 22nm and beyond
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