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Throughput maximization for periodic real-time systems under the maximal temperature constraint

Published: 05 June 2011 Publication History

Abstract

We study the problem on how to maximize the throughput for a periodic real-time system under the given peak temperature constraint. We assume that different tasks in our system may have different power and thermal characteristics. Two algorithms are presented in this paper. The first one is built upon processors that can be either in active or sleep mode. By judiciously selecting tasks with different thermal characteristics as well as alternating the processor active/sleep mode, our approach can improve the throughput upon the existing techniques by 21% in average. We further extend this approach for processors with dynamic voltage/frequency scaling (DVFS) capability. Our experiments show that an improvement of 24% can be achieved when compared with the existing methods.

References

[1]
Hotspot 4.2 temperature modeling tool. University of Virgina, page http://lava.cs.virginia.edu/HotSpot, 2009.
[2]
D. Brooks, V. Tiwari, and M. Martonosi. Wattch: a framework for architectural-level power analysis and optimizations. In ISCA, pages 83--94, 2000.
[3]
T. Chantem, X. S. Hu, and R. Dick. Online work maximization under a peak temperature constraint. In ISLPED, pages 105--110, 2009.
[4]
V. Chaturvedi, H. Huang, and G. Quan. Leakage aware scheduling on maximal temperature minimization for periodic hard real-time systems. In ICESS, 2010.
[5]
H. Huang, G. Quan, and J. Fan. Leakage temperature dependency modeling in system level analysis. In ISQED, pages 447--452, 2010.
[6]
R. Jayaseelan and T. Mitra. Temperature aware task sequencing and voltage scaling. In ICCAD, pages 618--623, 2008.
[7]
W. Liao, L. He, and K. Lepak. Temperature and supply voltage aware performance and power modeling at microarchitecture level. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 24(7):1042--1053, 2005.
[8]
S. Liu, M. Qiu, W. Gao, X.-J. Tang, and B. Guo. Hybrid of job sequencing and DVFS for peak temperature reduction with nondeterministic applications. In ICESS, pages 1780--1787, 2010.
[9]
Y. Liu, R. P. Dick, L. Shang, and H. Yang. Accurate temperature-dependent integrated circuit leakage power estimation is easy. In DATE, pages 1526--1531, 2007.
[10]
Y. Liu, H. Yang, R. P. Dick, H. Wang, and L. Shang. Thermal vs energy optimization for DVFS-enabled processors in embedded systems. In ISQED, pages 204--209, 2007.
[11]
G. Quan and Y. Zhang. Leakage aware feasibility analysis for temperature-constrained hard real-time periodic tasks. ECRTS, pages 207--216, 2009.
[12]
M. Santarini. Thermal integrity: A must for low-power ic digital design. EDN, pages 37--42, 2005.
[13]
K. Skadron, M. Stan, W. Huang, S. Velusamy, K. Sankaranarayanan, and D. Tarjan. Temperature-aware microarchitecture. ICSA, pages 2--13, 2003.
[14]
C.-Y. Yang, J.-J. Chen, L. Thiele, and T.-W. Kuo. Energy-efficient real-time task scheduling with temperature-dependent leakage. In DATE, pages 9--14, 2010.
[15]
L.-T. Yeh and R. C. Chu. Thermal Management of Microelectronic Equipment: Heat Transfer Theory, Analysis Methods, and Design Practices. ASME Press, New York, NY, 2002.
[16]
S. Zhang and K. S. Chatha. Approximation algorithm for the temperature-aware scheduling problem. In ICCAD, pages 281--288, 2007.
[17]
S. Zhang and K. S. Chatha. Thermal aware task sequencing on embedded processors. In DAC, pages 585--590, 2010.

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cover image ACM Conferences
DAC '11: Proceedings of the 48th Design Automation Conference
June 2011
1055 pages
ISBN:9781450306362
DOI:10.1145/2024724
Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than ACM must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from [email protected]

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Published: 05 June 2011

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Author Tags

  1. dynamic voltage/frequency scaling
  2. task sequencing references
  3. thermal aware real-time scheduling

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  • (2018)Makespan Minimization for Multiprocessor Real-Time Systems under Thermal and Timing ConstraintsJournal of Circuits, Systems and Computers10.1142/S0218126619501457(1950145)Online publication date: 7-Sep-2018
  • (2018)Thermal-Aware Resource Management for Embedded Real-Time SystemsIEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems10.1109/TCAD.2018.285727937:11(2857-2868)Online publication date: Nov-2018
  • (2018)Leveraging User Heterogeneities to Maximize Profits in the Cloud2018 IEEE 24th International Conference on Parallel and Distributed Systems (ICPADS)10.1109/PADSW.2018.8644983(170-177)Online publication date: Dec-2018
  • (2017)Improving System-Level Lifetime Reliability of Multicore Soft Real-Time SystemsIEEE Transactions on Very Large Scale Integration (VLSI) Systems10.1109/TVLSI.2017.266914425:6(1895-1905)Online publication date: Jun-2017
  • (2016)Performance Maximization via Frequency Oscillation on Temperature Constrained Multi-core Processors2016 45th International Conference on Parallel Processing (ICPP)10.1109/ICPP.2016.67(526-535)Online publication date: Aug-2016
  • (2015)Joint Work and Voltage/Frequency Scaling for Quality-Optimized Dynamic Thermal ManagementIEEE Transactions on Very Large Scale Integration (VLSI) Systems10.1109/TVLSI.2014.233374123:6(1017-1030)Online publication date: Jun-2015
  • (2014)Thermal-aware frequency scaling for adaptive workloads on heterogeneous MPSoCsProceedings of the conference on Design, Automation & Test in Europe10.5555/2616606.2617030(1-6)Online publication date: 24-Mar-2014
  • (2013)Enhancing multicore reliability through wear compensation in online assignment and schedulingProceedings of the Conference on Design, Automation and Test in Europe10.5555/2485288.2485616(1373-1378)Online publication date: 18-Mar-2013
  • (2013)Slack-Time-Aware Energy Efficient Scheduling for Multiprocessor SoCs2013 IEEE 10th International Conference on High Performance Computing and Communications & 2013 IEEE International Conference on Embedded and Ubiquitous Computing10.1109/HPCC.and.EUC.2013.48(278-285)Online publication date: Nov-2013
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