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PRO3D: programming for future 3D manycore architectures

Published: 25 January 2012 Publication History

Abstract

PRO3D tackles two 3D technologies and their consequences on stacked architectures and software stack: through silicon vias (TSV) and liquid cooling. 3D memory hierarchies and the thermal impact of software on the 3D stack are mainly explored. The PRO3D software development flow is based on a rigorous assembly of software components and monitors the thermal integrity of the 3D stack. PRO3D experiments are mainly targeted on P2012, an industrial embedded manycore platform.

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cover image ACM Other conferences
INA-OCMC '12: Proceedings of the 2012 Interconnection Network Architecture: On-Chip, Multi-Chip Workshop
January 2012
51 pages
ISBN:9781450310109
DOI:10.1145/2107763
Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than ACM must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from [email protected]

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Association for Computing Machinery

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Published: 25 January 2012

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INA-OCMC '12
INA-OCMC '12: On-Chip, Multi-Chip
January 25, 2012
Paris, France

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